X-On Electronics has gained recognition as a prominent supplier of CD-02-05-190 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. CD-02-05-190 Thermal Interface Products are a product manufactured by Wakefield. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.
We are delighted to provide the CD-02-05-190 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CD-02-05-190 and other electronic components in the Thermal Interface Products category and beyond.
-VetteThe Wakefield-Vette CD-02-05-190 Thermal Interface Products ulTIMiFlux Dielectric Phase Change is a 7.75" x 10.00" rectangular pad that is 0.003" thick. It is designed to optimize heat transfer between metalized surfaces in areas that require precision thermal management. The ulTIMiFlux technology incorporates a soft elastic interface that acts as a thermal bridge to provide a uniform, gap filling phase change material offering higher reliability for high current applications. This ensures consistent, reliable, and efficient thermal management by compensating for the large gap areas caused by misalignment and uneven surfaces. It offers flexibility and conformance to accommodate mechanical movement as well as the ability to provide high levels of power transfer from components, such as , ICs, sensors, LEDs and power transistors. This pad is ideal for applications that require robust heat transfer and demanding interface environments.