Product Information

WAVE-34-21

WAVE-34-21 electronic component of Wakefield

Datasheet
Heat Sinks Wave Series Low Profile Heatsink BGA Chipset Aluminum Top Mount, 34x34x21mm
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 4.9154 ea
Line Total: USD 4.92

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - Global Stock


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 4
Multiples : 4

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WAVE-34-21
Wakefield

4 : USD 10.71
25 : USD 7.3762
50 : USD 7.1531
100 : USD 6.3919
250 : USD 6.0506
500 : USD 5.8012
1000 : USD 5.5125

0 - Global Stock


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1

Stock Image

WAVE-34-21
Wakefield

1 : USD 5.0715
10 : USD 4.9387
25 : USD 4.6126
100 : USD 4.3953
250 : USD 4.19
500 : USD 4.0452
1000 : USD 3.864
2000 : USD 3.864
5000 : USD 3.864

Read More Specifications

     
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Heatsink Material
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Additional Infomation About Product

Wave Series Heat Sink with Integrated Clip Assembly BGA Heat Sinks The Wakefield-Vette Wave Series Heat Sink Series are a superior choice for cooling BGA applications in which limited height/footprint while achieving maximum surface area. The Wave Series Heat Sinks include a unique clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The clipping mechanism allows for easy installation in high production assembly. Features & Benefits Approximately 12% better thermal performance than traditional footprint heat sinks Height- A low profile design allows for more surface area in a height restricted application Clipping mechanism included with heat sink Surface Area- Fin array allows for more surface area for forced convection Easily customizable Easily compatible with major BGA device manufacturers components such as: Broadcomm, Motorola, Freescale, TI, Intel, etc. Material Specifications Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish. Spring Clip: 304 Stainless Steel, 1.2mm 0.47 DIA RoHS Compliant Mechanical Dimensions (mm) Thermal Resistance - WkV Part Attachment Fin Surface Area Height Off Base Forced Conv. Number Description Method Length Width Width Height (sq mm) (Fin Height) 200 LFM WAVE-23-125 Spring-Anchor 23 23 40 12.5 6055.1 10.5 6.76 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-23-165 Spring-Anchor 23 23 46.5 16.5 7634.6 14.5 5.08 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-29-127 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08 WAVE-32-12 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 32 32 50.2 12 10957.5 10 4.64 WAVE-34-21 Spring-Anchor 34 34 70 21 21268.4 19 2.19 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-12 Spring-Anchor 35 35 62 12 15180.8 10 3.83 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-125 Spring-Anchor 35 35 63.3 12.5 15792.6 10.5 3.63 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-15 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 35 35 58.1 15 15612.7 13 3.15 WAVE-35-21 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 35 35 74.6 21 21721.8 19 2.11 WAVE-366-175 Spring-Anchor 36.6 36.6 63.6 17.5 18637.8 15.5 2.55 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-40-12 Spring-Anchor 40 40 66.9 12 17689.4 10 3.36 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-40-125 Spring-Anchor 40 40 68.3 12.5 18410.1 10.5 3.16 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-425-117 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 42.5 42.5 67.4 11.7 21668.3 9.3 3.40 WAVE-45-12 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 45 45 72 12 22303.7 10 2.96Wave Series Heat Sink with Integrated Clip Assembly BGA Heat Sinks Wave 2x Series Mechanical Dimensions (mm) Thermal Resistance - WkV Part Attachment Fin Surface Area Height Off Base Forced Conv. Number Description Method Length Width Width Height (sq mm) (Fin Height) 200 LFM WAVE-23-125 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 23 23 40 12.5 6055.1 10.5 6.76 WAVE-23-165 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 23 23 46.5 16.5 7634.6 14.5 5.08 WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-29-127 Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-23-125 WAVE-23-165

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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