Product Information

W25Q128FVEIG

W25Q128FVEIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 3V/3.3V 128M-bit 16M x 8 7ns 8-Pin WSON EP
Manufacturer: Winbond
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Price (USD)

20: USD 1.622 ea
Line Total: USD 32.44

0 - Global Stock
MOQ: 20  Multiples: 1
Pack Size: 1

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0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 20
Multiples : 1

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W25Q128FVEIG
Winbond

20 : USD 1.622

Read More Specifications

     
Manufacturer
Product Category
Mounting Style
Package / Case
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Access Time Max
Address Bus
Boot Type
Operating Temp Range
Pin Count
Program/Erase Volt Typ
Density
Operating Temperature Classification
Programmable
Rad Hardened
Operating Supply Voltage Typ
Cell Type
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Additional Infomation About Product

W25Q128FV 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: August 24, 2015 Revision L W25Q128FV Table of Contents 1. GENERAL DESCRIPTIONS ..................................................................................................................... 5 2. FEATURES ............................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ................................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .......................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm................................................................................... 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6 3.4 Pin Configuration SOIC 300-mil ....................................................................................................... 7 3.5 Pin Description SOIC 300-mil ........................................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................................. 8 3.7 Ball Description TFBGA 8x6-mm ...................................................................................................... 8 3.8 Pin Configuration PDIP 300-mil ........................................................................................................ 9 3.9 Pin Description PDIP 300-mil ........................................................................................................... 9 4. PIN DESCRIPTIONS ............................................................................................................................... 10 4.1 Chip Select (/CS) ............................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................................. 10 4.3 Write Protect (/WP) ......................................................................................................................... 10 4.4 HOLD (/HOLD) ............................................................................................................................... 10 4.5 Serial Clock (CLK) .......................................................................................................................... 10 4.6 Reset (/RESET) .............................................................................................................................. 10 5. BLOCK DIAGRAM ................................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ............................................................................................................. 12 6.1 SPI / QPI Operations ...................................................................................................................... 12 6.1.1 Standard SPI Instructions ............................................................................................................................... 12 6.1.2 Dual SPI Instructions ...................................................................................................................................... 12 6.1.3 Quad SPI Instructions ..................................................................................................................................... 13 6.1.4 QPI Instructions .............................................................................................................................................. 13 6.1.5 Hold Function ................................................................................................................................................. 13 6.1.6 Software Reset & Hardware /RESET pin ........................................................................................................ 15 6.2 Write Protection .............................................................................................................................. 16 6.2.1 Write Protect Features .................................................................................................................................... 16 7. STATUS AND CONFIGURATION REGISTERS .................................................................................... 17 7.1 Status Registers ............................................................................................................................. 17 7.1.1 Erase/Write In Progress (BUSY) Status Only .............................................................................................. 17 7.1.2 Write Enable Latch (WEL) Status Only ........................................................................................................ 17 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable .............................................................. 17 - 1 -

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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