Product Information

W25Q128FWFIG

W25Q128FWFIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 1.8V 128M-bit 16M x 8 7.5ns 16-Pin SOIC

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

23: USD 2.7521 ea
Line Total: USD 63.3

0 - Global Stock
MOQ: 23  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 23
Multiples : 1

Stock Image

W25Q128FWFIG
Winbond

23 : USD 2.7521
25 : USD 2.472
50 : USD 2.3581
100 : USD 2.189

     
Manufacturer
Product Category
Mounting Style
Package / Case
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Access Time Max
Address Bus
Operating Temperature Classification
Density
Operating Supply Voltage Typ
Operating Temp Range
Rad Hardened
Boot Type
Program/Erase Volt Typ
Programmable
Cell Type
Pin Count
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W25Q128FWPIG electronic component of Winbond W25Q128FWPIG

NOR Flash Serial-SPI 1.8V 128M-bit 16M x 8 7.5ns 8-Pin WSON EP
Stock : 0

W25Q128FWPIGTR electronic component of Winbond W25Q128FWPIGTR

NOR Flash spiFlash, 128M-bit, 4Kb Uniform Sector
Stock : 0

W25Q128JVEIM electronic component of Winbond W25Q128JVEIM

NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector, DTR
Stock : 1270

W25Q128JVBIQ electronic component of Winbond W25Q128JVBIQ

NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector
Stock : 9996

W25Q128FWSIG electronic component of Winbond W25Q128FWSIG

NOR Flash spiFlash, 128M-bit, 4Kb Uniform Sector
Stock : 0

W25Q128JVEIQ electronic component of Winbond W25Q128JVEIQ

NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector
Stock : 1719

W25Q128JVBIM electronic component of Winbond W25Q128JVBIM

NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector, DTR
Stock : 0

W25Q128JVEIM TR electronic component of Winbond W25Q128JVEIM TR

NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector, DTR
Stock : 5543

W25Q128JVCIM electronic component of Winbond W25Q128JVCIM

NOR Flash spiFlash 3V 128M-bit 4Kb Uniform Sector DTR
Stock : 0

W25Q128JVCIQ electronic component of Winbond W25Q128JVCIQ

NOR Flash spiFlash 3V 128M-bit 4Kb Uniform Sector
Stock : 0

Image Description
W25Q128JVSIM electronic component of Winbond W25Q128JVSIM

FLASH - NOR Memory IC 128Mbit SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC
Stock : 593

W25Q16DVSNIG TR electronic component of Winbond W25Q16DVSNIG TR

W25Q16DVSNIG TR winbond
Stock : 0

W25Q16DWSSIG TR electronic component of Winbond W25Q16DWSSIG TR

W25Q16DWSSIG TR
Stock : 0

W25Q16DWZPIG electronic component of Winbond W25Q16DWZPIG

NOR Flash Serial-SPI 1.8V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Stock : 0

4-1971905-7 electronic component of TE Connectivity 4-1971905-7

Bench Top Tools PLUG HOUSING 14POS KEYING-DNEW GIC3.3
Stock : 240

LC75829PEH-TLA-H electronic component of ON Semiconductor LC75829PEH-TLA-H

LCD Drivers LCD Driver, 1/4, 1/3 Duty, General-Purpose
Stock : 0

W25Q80BLSNIG electronic component of Winbond W25Q80BLSNIG

NOR Flash Serial-SPI 2.5V/3.3V 8M-bit 1M x 8 9ns 8-Pin SOIC
Stock : 0

W260-A1A-004M1 electronic component of Leach W260-A1A-004M1

Electromechanical Relay 26.5VDC 700Ohm 2A DPDT (20.57x10.41x10.41)mm THT Half Size High Performance Relay
Stock : 0

W260-A1A-004M2 electronic component of Leach W260-A1A-004M2

Electromechanical Relay 26.5VDC 700Ohm 2A DPDT (20.57x10.41x10.41)mm THT Half Size High Performance Relay
Stock : 63

W260-B2A-004L1 electronic component of Leach W260-B2A-004L1

Electromechanical Relay - DPDT - 2A - 26.5VDC - 700Ohm - Panel Mount.
Stock : 244

W25Q128FW 1.8V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: August 30, 2013 Revision D W25Q128FW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP)............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions .......................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 Hold Function ....................................................................................................................... 12 6.1.6 Software Reset & Hardware /RESET pin ............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 6.2.1 Write Protect Features ......................................................................................................... 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) Status Only .................................................................... 15 7.1.2 Write Enable Latch (WEL) Status Only.............................................................................. 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable.................................... 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................... 16 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................... 16 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted