Product Information

W25Q128JVBIQ

W25Q128JVBIQ electronic component of Winbond

Datasheet
NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.3305 ea
Line Total: USD 2.33

9696 - Global Stock
Ships to you between
Thu. 23 May to Mon. 27 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
9696 - WHS 1


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

W25Q128JVBIQ
Winbond

1 : USD 2.3305
10 : USD 2.1252
100 : USD 1.7508
480 : USD 1.6663
25440 : USD 1.5577

     
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RoHS - XON
Icon ROHS
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W25Q128JV 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI For Industrial & Industrial Plus Grade Publication Release Date: March 27, 2018 Revision F W25Q128JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 5 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm ....................................................................... 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Ball Configuration WLCSP ................................................................................................... 8 3.9 Ball Description WLCSP24 ................................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 Standard SPI Instructions ................................................................................................... 11 6.2 Dual SPI Instructions .......................................................................................................... 11 6.3 Quad SPI Instructions ......................................................................................................... 11 6.4 Software Reset & Hardware /RESET pin ........................................................................... 11 6.5 Write Protection .................................................................................................................. 12 6.5.1 Write Protect Features ......................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13 7.1 Status Registers ................................................................................................................. 13 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 13 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 13 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 14 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ....................................... 14 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 14 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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