Product Information

W25Q16CLSNIG

W25Q16CLSNIG electronic component of Winbond

Datasheet
NOR Flash Serial-SPI 2.5V/3.3V 16M-bit 2M x 8 9ns 8-Pin SOIC

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

83: USD 0.8346 ea
Line Total: USD 69.27

0 - Global Stock
MOQ: 83  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 08 May to Tue. 14 May

MOQ : 83
Multiples : 1

Stock Image

W25Q16CLSNIG
Winbond

83 : USD 0.8346
100 : USD 0.7633

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Interface Type
Operating Supply Voltage
Brand
Access Time Max
Address Bus
Boot Type
Mounting
Operating Temp Range
Package Type
Pin Count
Program/Erase Volt Typ
Density
Number Of Words
Word Size
Operating Temperature Max
Operating Temperature Min
Sync/Async
Operating Temperature Classification
Programmable
Supply Current
Rad Hardened
Operating Supply Voltage Min
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W25Q16DVSNIG TR electronic component of Winbond W25Q16DVSNIG TR

W25Q16DVSNIG TR winbond
Stock : 0

W25Q16DWSSIG TR electronic component of Winbond W25Q16DWSSIG TR

W25Q16DWSSIG TR
Stock : 0

W25Q16DWZPIG electronic component of Winbond W25Q16DWZPIG

NOR Flash Serial-SPI 1.8V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Stock : 0

W25Q16FWSSIQ electronic component of Winbond W25Q16FWSSIQ

Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 16M-bit 2M x 8 6ns
Stock : 0

W25Q16DWBYIG-TR electronic component of Winbond W25Q16DWBYIG-TR

Winbond Electronics Corporation
Stock : 0

W25Q16DVZPIG electronic component of Winbond W25Q16DVZPIG

NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Stock : 0

W25Q16DVSSIG electronic component of Winbond W25Q16DVSSIG

NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin SOIC W
Stock : 0

W25Q16DVSNIG electronic component of Winbond W25Q16DVSNIG

NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin SOIC
Stock : 0

W25Q16FWSNIQ electronic component of Winbond W25Q16FWSNIQ

NOR Flash spiFlash, 1.8V, 16M-bit, 4Kb Uniform Sector
Stock : 0

W25Q16FWUUIQ TR electronic component of Winbond W25Q16FWUUIQ TR

NOR Flash spiFlash 1.8V 16M-bit 4Kb Uniform Sector
Stock : 0

Image Description
USBMULTILINKBDME electronic component of NXP USBMULTILINKBDME

Programmers - Processor Based USB BDM MULTILINK CABLE
Stock : 0

USBMULTILINK08E electronic component of NXP USBMULTILINK08E

Programmers - Processor Based MON08 Multilink Dev Tool
Stock : 0

USB-ICP-LPC2K electronic component of Future Designs USB-ICP-LPC2K

Programmers - Processor Based In-System Programmer for NXP ARM7 LPC2xxx
Stock : 0

ST-LINK/V2-ISOL electronic component of STMicroelectronics ST-LINK/V2-ISOL

Programmers - Processor Based ST-LINK Debugger STM8 STM32 DIG ISO
Stock : 28

MT29F1G16ABBDAHC-IT:D electronic component of Micron MT29F1G16ABBDAHC-IT:D

SLC NAND Flash Parallel 1.8V 1G-bit 64M x 16 63-Pin VFBGA Tray
Stock : 0

MT29F4G16ABADAH4:D electronic component of Micron MT29F4G16ABADAH4:D

SLC NAND Flash Parallel 3.3V 4G-bit 256M x 16 25ns 63-Pin VFBGA
Stock : 0

MSP-PRGS430 electronic component of Texas Instruments MSP-PRGS430

Programmers - Processor Based MSP-PRGS430 Serial Programmer
Stock : 0

M68CYCLONEPROE electronic component of NXP M68CYCLONEPROE

Programmers - Processor Based CYCLONE PRO IN-CIRCUIT P
Stock : 0

OM11006,598 electronic component of NXP OM11006,598

Programmers - Processor Based Hitex LPC-Stick with LPC2468
Stock : 0

W25Q16CL 2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 23, 2014 - 1 - - Revision G W25Q16CL Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES ............................................................................................................................ 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-MIL ........................................................ 6 3.2 PAD Configuration WSON 6x5-mm ..................................................................................... 6 3.3 Pin Descriptions .................................................................................................................... 7 3.3.1 Chip Select (/CS) ................................................................................................................... 7 3.3.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ....................................... 7 3.3.3 Write Protect (/WP) ................................................................................................................ 7 3.3.4 HOLD (/HOLD) ....................................................................................................................... 7 3.3.5 Serial Clock (CLK) .................................................................................................................. 7 4. BLOCK DIAGRAM ............................................................................................................................ 8 5. FUNCTIONAL DESCRIPTION ......................................................................................................... 9 5.1 SPI OPERATIONS ............................................................................................................... 9 5.1.1 Standard SPI Instructions ...................................................................................................... 9 5.1.2 Dual SPI Instructions .............................................................................................................. 9 5.1.3 Quad SPI Instructions ............................................................................................................ 9 5.1.4 Hold Function ......................................................................................................................... 9 5.2 WRITE PROTECTION ....................................................................................................... 10 5.2.1 Write Protect Features ......................................................................................................... 10 6. CONTROL AND STATUS REGISTERS ......................................................................................... 11 6.1 STATUS REGISTER .......................................................................................................... 11 6.1.1 BUSY.................................................................................................................................... 11 6.1.2 Write Enable Latch (WEL) ................................................................................................... 11 6.1.3 Block Protect Bits (BP2, BP1, BP0) ..................................................................................... 11 6.1.4 Top/Bottom Block Protect (TB) ............................................................................................. 11 6.1.5 Sector/Block Protect (SEC) .................................................................................................. 11 6.1.6 Complement Protect (CMP) ................................................................................................. 12 6.1.7 Status Register Protect (SRP1, SRP0) ................................................................................ 12 6.1.8 Erase/Program Suspend Status (SUS) ................................................................................ 12 6.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 12 6.1.10 Quad Enable (QE) .............................................................................................................. 13 6.1.11 Status Register Memory Protection (CMP = 0) .................................................................. 14 6.1.12 Status Register Memory Protection (CMP = 1) .................................................................. 15 6.2 INSTRUCTIONS ................................................................................................................. 16 6.2.1 Manufacturer and Device Identification ................................................................................ 16 (1) 6.2.2 Instruction Set Table 1 (Erase, Program Instructions) ...................................................... 17 6.2.3 Instruction Set Table 2 (Read Instructions) .......................................................................... 18 - 2 -

Tariff Desc

8543.70.00 Other machines and apparatus Free
13 Signal processors (graphic equalisers, crossovers etc.) 91 Other Free

9027.10.00 Instruments and apparatus for physical or chemical analysis (eg, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes Free

9031.80.00 MEASURING OR CHECKING INSTRUMENTS, APPLIANCES AND MACHINES, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER; PROFILE PROJECTORS Other instruments, appliances and machines Free

9030.31.00 Oscilloscopes, spectrum analysers and other instruments and apparatus for measuring or checking electrical quantities, excluding meters of 9028; instruments and apparatus for measuring or detecting alpha, beta, gamma, x-ray, cosmic or other ionising radiations.
Other instruments and apparatus, for measuring or checking voltage, current, resistance or power Multimeters without a recording device Free

8473.30.00 Parts and accessories of the machines of 8471 AUTOMATIC DATA PROCESSING MACHINES AND UNITS THEREOF; MAGNETIC OR OPTICAL READERS, MACHINES FOR TRANSCRIBING DATA ONTO DATA MEDIA IN CODED FORM AND MACHINES FOR PROCESSING SUCH DATA, NOT ELSEWHERE SPECIFIED OR INCLUDED:
.Other 71 No Weighing less than 1kg Free

8537 BOARDS, PANELS, CONSOLES, DESKS, CABINETS AND OTHER BASES, EQUIPPED WITH TWO OR MORE APPARATUS OF 8535 OR 8536, FOR ELECTRIC CONTROL OR THE DISTRIBUTION OF ELECTRICITY, INCLUDING THOSE INCORPORATING INSTRUMENTS OR APPARATUS OF CHAPTER 90, AND NUMERICAL CONTROL APPARATUS, OTHER THAN SWITCHING APPARATUS OF 8517:
8538 PARTS SUITABLE FOR USE SOLELY OR PRINCIPALLY WITH THE APPARATUS OF 8535, 8536 OR 8537:
8538.10.10 22 For programmable controllers Free
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted