W25Q32JVSFIQ TR Winbond

W25Q32JVSFIQ TR electronic component of Winbond
W25Q32JVSFIQ TR Winbond
W25Q32JVSFIQ TR NOR Flash
W25Q32JVSFIQ TR  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q32JVSFIQ TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q32JVSFIQ TR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q32JVSFIQ TR
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 32M-bit, DTR, 4Kb Uniform Sector
Datasheet: W25Q32JVSFIQ TR Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 1000
Multiples : 1000
QtyUnit Price
1000$ 0.899
10000$ 0.8709
100000$ 0.7101
500000$ 0.6309
1000000$ 0.6303
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.1554
10$ 1.0615
100$ 0.9599
500$ 0.9379
1000$ 0.9032
2000$ 0.8595
5000$ 0.8466
10000$ 0.817
25000$ 0.7771
N/A

Obsolete
   
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We are delighted to provide the W25Q32JVSFIQ TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q32JVSFIQ TR and other electronic components in the NOR Flash category and beyond.

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W25Q32JV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI For Industrial & Industrial Plus Grade Publication Release Date: March 27, 2018 -Revision G W25Q32JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 150/208-mil & VSOP 208-mil ......................................................... 5 3.2 Pad Configuration WSON 6x5-mm/ 8X6-mm, XSON 4x4-mm ............................................ 5 3.3 Pin Description SOIC 150/208-mil, VSOP 208-mil, WSON 6x5-mm/8x6-mm, XSON 4x4- mm 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Pin Configuration PDIP 300-mil ............................................................................................ 8 3.9 Pin Description PDIP 300-mil ............................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP) ............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 (1) 4.6 Reset (/RESET) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 Standard SPI Instructions ................................................................................................... 11 6.2 Dual SPI Instructions .......................................................................................................... 11 6.3 Quad SPI Instructions......................................................................................................... 11 6.4 Software Reset & Hardware /RESET pin ........................................................................... 11 6.5 Write Protection .................................................................................................................. 12 Write Protect Features .......................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13 7.1 Status Registers ................................................................................................................. 13 Erase/Write In Progress (BUSY) Status Only ................................................................. 13 Write Enable Latch (WEL) Status Only ........................................................................... 13 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 13 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 14 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 14 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 14 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ................................ 15 Erase/Program Suspend Status (SUS) Status Only ....................................................... 16 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ........... 16 Quad Enable (QE) Volatile/Non-Volatile Writable ........................................................... 16 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ........................................ 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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