X-On Electronics has gained recognition as a prominent supplier of W25Q64JVZPIQ TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q64JVZPIQ TR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q64JVZPIQ TR Winbond

W25Q64JVZPIQ TR electronic component of Winbond
W25Q64JVZPIQ TR Winbond
W25Q64JVZPIQ TR NOR Flash
W25Q64JVZPIQ TR  Semiconductors

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See Product Specifications
Part No. W25Q64JVZPIQ TR
Manufacturer: Winbond
Category: NOR Flash
Description: FLASH - NOR Memory IC 64Mb (8M x 8) SPI - Quad I/O 133 MHz 8-WSON (6x5)
Datasheet: W25Q64JVZPIQ TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.1563 ea
Line Total: USD 1.16 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 5000
Multiples : 5000
5000 : USD 1.0203
10000 : USD 1.0149
15000 : USD 1.0094
20000 : USD 1.0038
25000 : USD 0.9982
30000 : USD 0.9925
40000 : USD 0.9868
50000 : USD 0.981
100000 : USD 0.9752

0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 5000
Multiples : 5000
5000 : USD 0.8719
10000 : USD 0.8579

0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 1
Multiples : 1
1 : USD 1.4962
10 : USD 1.3205
25 : USD 1.2852
50 : USD 1.2784
100 : USD 1.1428
250 : USD 1.1395
500 : USD 1.1223
1000 : USD 1.0747

0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 1
Multiples : 1
1 : USD 1.4962
10 : USD 1.3205
25 : USD 1.2852
50 : USD 1.2784
100 : USD 1.1428
250 : USD 1.1395
500 : USD 1.1223
1000 : USD 1.0747

0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 5000
Multiples : 5000
5000 : USD 1.0423
10000 : USD 0.9741

0
Ship by Fri. 27 Jun to Tue. 01 Jul
MOQ : 1
Multiples : 1
1 : USD 1.1563
10 : USD 1.0105
100 : USD 0.9066
250 : USD 0.8778
500 : USD 0.8662
1000 : USD 0.8466
5000 : USD 0.8201
10000 : USD 0.805

0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 9
Multiples : 1
9 : USD 1.1383
10 : USD 1.0576
25 : USD 1.0514
100 : USD 0.9829
250 : USD 0.9802
500 : USD 0.9666
1000 : USD 0.888

0
Ship by Tue. 01 Jul to Mon. 07 Jul
MOQ : 9
Multiples : 1
9 : USD 1.4409

   
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We are delighted to provide the W25Q64JVZPIQ TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q64JVZPIQ TR and other electronic components in the NOR Flash category and beyond.

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W25Q64JV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: March 27, 2018 Revision J W25Q64JV Table of Contents 1. GENERAL DESCRIPTIONS .................................................................................................................. 4 2. FEATURES ............................................................................................................................................ 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................... 5 3.1 Pin Configuration SOIC 208-mil ................................................................................................ 5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm .................................................. 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ............................... 5 3.4 Pin Configuration SOIC 300-mil ................................................................................................ 6 3.5 Pin Description SOIC 300-mil .................................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ...................................................... 7 3.7 Ball Description TFBGA 5x5 or 8x6-mm ................................................................................... 7 3.8 Ball Configuration WLCSP ........................................................................................................ 8 3.9 Ball Description WLCSP12 ........................................................................................................ 8 4. PIN DESCRIPTIONS ............................................................................................................................. 9 4.1 Chip Select (/CS) ....................................................................................................................... 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ......................................... 9 4.3 Write Protect (/WP) .................................................................................................................... 9 4.4 HOLD (/HOLD) .......................................................................................................................... 9 4.5 Serial Clock (CLK) ..................................................................................................................... 9 (1) 4.6 Reset (/RESET) ...................................................................................................................... 9 5. BLOCK DIAGRAM ............................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS .......................................................................................................... 11 6.1 Standard SPI Instructions ........................................................................................................ 11 6.2 Dual SPI Instructions ............................................................................................................... 11 6.3 Quad SPI Instructions.............................................................................................................. 11 6.4 Software Reset & Hardware /RESET pin ................................................................................ 11 6.5 Write Protection ....................................................................................................................... 12 Write Protect Features ............................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ................................................................................. 13 7.1 Status Registers ...................................................................................................................... 13 Erase/Write In Progress (BUSY) Status Only ...................................................................... 13 Write Enable Latch (WEL) Status Only ................................................................................ 13 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ...................................... 13 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ............................................. 14 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ............................................. 14 Complement Protect (CMP) Volatile/Non-Volatile Writable ................................................. 14 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ..................................... 15 Erase/Program Suspend Status (SUS) Status Only ............................................................ 16 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ................ 16 Quad Enable (QE) Volatile/Non-Volatile Writable ................................................................ 16 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ............................................. 17 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ................................. 17 Publication Release Date: March 27, 2018 - 1 - Revision J

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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