W25Q80DVSSIG Winbond

W25Q80DVSSIG electronic component of Winbond
W25Q80DVSSIG Winbond
W25Q80DVSSIG NOR Flash
W25Q80DVSSIG  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q80DVSSIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q80DVSSIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q80DVSSIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash Serial-SPI 3.3V 8M-bit 1M x 8 6ns 8-Pin SOIC W
Datasheet: W25Q80DVSSIG Datasheet (PDF)
Price (USD)
1: USD 0.6492 ea
Line Total: USD 0.65 
Availability : 4082
  
Ship by Wed. 19 Nov to Tue. 25 Nov
QtyUnit Price
1$ 0.6492
10$ 0.4988
30$ 0.4264
90$ 0.2697
540$ 0.2295
990$ 0.2221

Availability 26336
Ship by Wed. 19 Nov to Tue. 25 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.7244
10$ 0.5768
30$ 0.5154
100$ 0.2935
500$ 0.271
1000$ 0.2221


Availability 4082
Ship by Wed. 19 Nov to Tue. 25 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.6492
10$ 0.4988
30$ 0.4264
90$ 0.2697
540$ 0.2295
990$ 0.2221


Availability 2708
Ship by Mon. 17 Nov to Wed. 19 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.52
10$ 0.4988
25$ 0.4584
90$ 0.4081
270$ 0.4015
540$ 0.3927
1080$ 0.3861
5040$ 0.3861


Availability 560
Ship by Wed. 19 Nov to Tue. 25 Nov
MOQ : 466
Multiples : 1
QtyUnit Price
466$ 0.558
502$ 0.5188
519$ 0.5012
525$ 0.4959
538$ 0.484
556$ 0.4682
1080$ 0.435
5040$ 0.4077

   
Manufacturer
Product Category
Mounting Style
Package / Case
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Access Time Max
Address Bus
Pin Count
Operating Temperature Classification
Density
Operating Supply Voltage Typ
Operating Temp Range
Rad Hardened
Program/Erase Volt Typ
Programmable
Boot Type
Cell Type
Brand Category
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We are delighted to provide the W25Q80DVSSIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q80DVSSIG and other electronic components in the NOR Flash category and beyond.

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W25Q80DV/DL 2.5V AND 3V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date:October 02, 2015 - 1 - Preli mry-Revision H W25Q80DV/DL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 3.1 Pin Configuration SOIC 150-MIL/208-mil AND VSOP 150-mil: ...................................... 6 3.2 Pad Configuration WSON 6x5-mm, USON 2X3-mm...................................................... 6 3.3 Pin Configuration PDIP 300-mil ...................................................................................... 7 3.4 Pin Description SOIC/VSOP , WSON/USON & PDIP 300-mil ....................................... 7 3.5 Ball Configuration WLCSP .............................................................................................. 8 3.6 Ball Description WLCSP ................................................................................................. 8 4. PIN DESCRIPTIONS .................................................................................................................. 9 4.1 Chip Select (/CS) ............................................................................................................ 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 9 4.3 Write Protect (/WP) ......................................................................................................... 9 4.4 HOLD (/HOLD)................................................................................................................ 9 4.5 Serial Clock (CLK) .......................................................................................................... 9 5. BLOCK DIAGRAM .................................................................................................................... 10 6. FUNCTIONAL DESCRIPTION.................................................................................................. 11 6.1 SPI OPERATIONS ....................................................................................................... 11 6.1.1 Standard SPI Instructions ............................................................................................... 11 6.1.2 Dual SPI Instructions ...................................................................................................... 11 6.1.3 Quad SPI Instructions ..................................................................................................... 11 6.1.4 Hold Function .................................................................................................................. 11 6.2 WRITE PROTECTION .................................................................................................. 12 6.2.1 Write Protect Features .................................................................................................... 12 7. CONTROL AND STATUS REGISTERS ................................................................................... 13 7.1 STATUS REGISTER .................................................................................................... 13 7.1.1 BUSY .............................................................................................................................. 13 7.1.2 Write Enable Latch (WEL) .............................................................................................. 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 13 7.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 13 7.1.5 Sector/Block Protect (SEC) ............................................................................................. 13 7.1.6 Complement Protect (CMP) ............................................................................................ 14 7.1.7 Status Register Protect (SRP1, SRP0) ........................................................................... 14 7.1.8 Erase/Program Suspend Status (SUS) ........................................................................... 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ................................................................... 14 7.1.10 Quad Enable (QE) ........................................................................................................ 15 7.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 16 7.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 17 8. INSTRUCTIONS ....................................................................................................................... 18 8.1 Manufacturer and Device Identification ........................................................................ 18 (1) 8.2 Instruction Set Table 1 (Standard SPI Instructions) .................................................. 19 8.3 Instruction Set Table 2 (Dual SPI Instructions) ............................................................. 20 8.4 Instruction Set Table 3 (Quad SPI Instructions) ........................................................... 20 8.5 Instruction Descriptions ................................................................................................ 22 Publication Release Date:October 02, 2015 - 2 - Preli mry-Revision H

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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