X-On Electronics has gained recognition as a prominent supplier of W631GG6NB15I DRAM across the USA, India, Europe, Australia, and various other global locations. W631GG6NB15I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W631GG6NB15I Winbond

W631GG6NB15I electronic component of Winbond
W631GG6NB15I Winbond
W631GG6NB15I DRAM
W631GG6NB15I  Semiconductors

Images are for reference only
See Product Specifications
Part No. W631GG6NB15I
Manufacturer: Winbond
Category: DRAM
Description: DRAM 1Gb DDR3 SDRAM, x16, Industrial Temp. 667MHz
Datasheet: W631GG6NB15I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.075 ea
Line Total: USD 4.08 
Availability - 258
Ship by Fri. 20 Jun to Tue. 24 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
258
Ship by Fri. 20 Jun to Tue. 24 Jun
MOQ : 1
Multiples : 1
1 : USD 4.075
10 : USD 3.381
25 : USD 3.058
100 : USD 2.849
198 : USD 2.838
594 : USD 2.651
5148 : USD 2.618

   
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Organisation
Memory Size
Maximum Clock Frequency
Supply Voltage - Max
Packaging
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W631GG6NB15I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W631GG6NB15I and other electronic components in the DRAM category and beyond.

Image Part-Description
Stock Image W9712G6KB25I
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 255
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9825G6KH-6
IC SDRAM 256MBIT 166MHZ 54TSOP
Stock : 9364
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9712G6KB-25
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9425G6KH-5
4 M X 4 BANKS X16 BITS DDR SDRAM
Stock : 23
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5I
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 8
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 1680
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9864G6KH-6
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II
Stock : 1661
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9816G6JH-7
DRAM 16M SDR SDRAM 133MHz
Stock : 685
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W956D8MBKX5I
DRAM 64Mb HyperRAM x8 200MHz Ind temp 1.8V
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G8NB-25
DRAM 512Mb DDR2-800, x8
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image M366S0924FTS-C7A00
DRAM Module SDRAM 64Mbyte 168UDIMM Tray
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT47H128M4CB-37E
DRAM Chip DDR2 SDRAM 512M-Bit 128Mx4 1.8V 60-Pin FBGA Tray
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image K4S560432C-TC75
DRAM Chip SDRAM 256M-Bit 64Mx4 3.3V 54-Pin TSOP-II
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image K4S641632H-UC60
DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II T/R
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image KM44C4100CK-6
DRAM Chip FPM 16M-Bit 4Mx4 5V 24-Pin SOJ
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT46V32M8TG-5B/G
DRAM Chip DDR SDRAM 256Mbit 32Mx8 2.6V 66-Pin TSOP Tray
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT46V64M4TG-6
DRAM Chip DDR SDRAM 256M-Bit 64Mx4 2.5V 66-Pin TSOP Tray
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image S27KS0641DPBHA020
DRAM Nor
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image IS42S16100H-7BLI-TR
DRAM 16M, 3.3V, SDRAM 1Mx16, 143Mhz,RoHS
Stock : 6312
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image NTE2117
DRAM Chip DRAM 16K-Bit 16Kx1 5V 16-Pin DIP
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

W631GG6NB 8M 8 BANKS 16 BIT DDR3 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 5 2. FEATURES ........................................................................................................................................... 5 3. ORDER INFORMATION ....................................................................................................................... 6 4. KEY PARAMETERS ............................................................................................................................. 7 5. BALL CONFIGURATION ...................................................................................................................... 9 6. BALL DESCRIPTION .......................................................................................................................... 10 7. BLOCK DIAGRAM .............................................................................................................................. 12 8. FUNCTIONAL DESCRIPTION ............................................................................................................ 13 8.1 Basic Functionality .............................................................................................................................. 13 8.2 RESET and Initialization Procedure .................................................................................................... 13 8.2.1 Power-up Initialization Sequence ..................................................................................... 13 8.2.2 Reset Initialization with Stable Power .............................................................................. 15 8.3 Programming the Mode Registers ....................................................................................................... 16 8.3.1 Mode Register MR0 ......................................................................................................... 18 8.3.1.1 Burst Length, Type and Order ................................................................................ 19 8.3.1.2 CAS Latency........................................................................................................... 19 8.3.1.3 Test Mode............................................................................................................... 20 8.3.1.4 DLL Reset............................................................................................................... 20 8.3.1.5 Write Recovery ....................................................................................................... 20 8.3.1.6 Precharge PD DLL ................................................................................................. 20 8.3.2 Mode Register MR1 ......................................................................................................... 21 8.3.2.1 DLL Enable/Disable ................................................................................................ 21 8.3.2.2 Output Driver Impedance Control ........................................................................... 22 8.3.2.3 ODT RTT Values .................................................................................................... 22 8.3.2.4 Additive Latency (AL) ............................................................................................. 22 8.3.2.5 Write leveling .......................................................................................................... 22 8.3.2.6 Output Disable ........................................................................................................ 22 8.3.3 Mode Register MR2 ......................................................................................................... 23 8.3.3.1 Partial Array Self Refresh (PASR) .......................................................................... 24 8.3.3.2 CAS Write Latency (CWL) ...................................................................................... 24 8.3.3.3 Auto Self Refresh (ASR) and Self Refresh Temperature (SRT) ............................. 24 8.3.3.4 Dynamic ODT (Rtt WR) ......................................................................................... 24 8.3.4 Mode Register MR3 ......................................................................................................... 25 8.3.4.1 Multi Purpose Register (MPR) ................................................................................ 25 8.4 No OPeration (NOP) Command .......................................................................................................... 26 8.5 Deselect Command ............................................................................................................................. 26 8.6 DLL-off Mode ...................................................................................................................................... 26 8.7 DLL on/off switching procedure ........................................................................................................... 27 8.7.1 DLL on to DLL off Procedure ....................................................................................... 27 8.7.2 DLL off to DLL on Procedure ....................................................................................... 28 8.8 Input clock frequency change ............................................................................................................. 29 8.8.1 Frequency change during Self-Refresh............................................................................ 29 8.8.2 Frequency change during Precharge Power-down .......................................................... 29 8.9 Write Leveling ..................................................................................................................................... 31 8.9.1 DRAM setting for write leveling & DRAM termination function in that mode .................... 32 Publication Release Date: Dec. 10, 2020 Revision: A01 - 1 - W631GG6NB 8.9.2 Write Leveling Procedure ................................................................................................. 32 8.9.3 Write Leveling Mode Exit ................................................................................................. 34 8.10 Multi Purpose Register ........................................................................................................................ 35 8.10.1 MPR Functional Description ............................................................................................. 36 8.10.2 MPR Register Address Definition ..................................................................................... 37 8.10.3 Relevant Timing Parameters ............................................................................................ 37 8.10.4 Protocol Example ............................................................................................................. 37 8.11 ACTIVE Command .............................................................................................................................. 43 8.12 PRECHARGE Command .................................................................................................................... 43 8.13 READ Operation ................................................................................................................................. 44 8.13.1 READ Burst Operation ..................................................................................................... 44 8.13.2 READ Timing Definitions .................................................................................................. 45 8.13.2.1 READ Timing Clock to Data Strobe relationship .................................................... 46 8.13.2.2 READ Timing Data Strobe to Data relationship ..................................................... 47 8.13.2.3 tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Calculation ............................................. 48 8.13.2.4 tRPRE Calculation .................................................................................................. 49 8.13.2.5 tRPST Calculation .................................................................................................. 49 8.13.2.6 Burst Read Operation followed by a Precharge...................................................... 55 8.14 WRITE Operation ................................................................................................................................ 57 8.14.1 DDR3 Burst Operation ..................................................................................................... 57 8.14.2 WRITE Timing Violations ................................................................................................. 57 8.14.2.1 Motivation ............................................................................................................... 57 8.14.2.2 Data Setup and Hold Violations .............................................................................. 57 8.14.2.3 Strobe to Strobe and Strobe to Clock Violations ..................................................... 57 8.14.2.4 Write Timing Parameters ........................................................................................ 57 8.14.3 Write Data Mask............................................................................................................... 58 8.14.4 tWPRE Calculation........................................................................................................... 59 8.14.5 tWPST Calculation ........................................................................................................... 59 8.15 Refresh Command .............................................................................................................................. 66 8.16 Self-Refresh Operation ....................................................................................................................... 68 8.17 Power-Down Modes ............................................................................................................................ 70 8.17.1 Power-Down Entry and Exit ............................................................................................. 70 8.17.2 Power-Down clarifications - Case 1 ................................................................................. 76 8.17.3 Power-Down clarifications - Case 2 ................................................................................. 76 8.17.4 Power-Down clarifications - Case 3 ................................................................................. 77 8.18 ZQ Calibration Commands .................................................................................................................. 78 8.18.1 ZQ Calibration Description ............................................................................................... 78 8.18.2 ZQ Calibration Timing ...................................................................................................... 79 8.18.3 ZQ External Resistor Value, Tolerance, and Capacitive loading ...................................... 79 8.19 On-Die Termination (ODT) .................................................................................................................. 80 8.19.1 ODT Mode Register and ODT Truth Table ...................................................................... 80 8.19.2 Synchronous ODT Mode .................................................................................................. 81 8.19.2.1 ODT Latency and Posted ODT ............................................................................... 81 8.19.2.2 Timing Parameters ................................................................................................. 81 8.19.2.3 ODT during Reads .................................................................................................. 83 8.19.3 Dynamic ODT .................................................................................................................. 84 8.19.3.1 Functional Description: ........................................................................................... 84 8.19.3.2 ODT Timing Diagrams ............................................................................................ 85 8.19.4 Asynchronous ODT Mode ................................................................................................ 89 Publication Release Date: Dec. 10, 2020 Revision: A01 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
PSR072DL0400X Fuse – Littelfuse 700V DC 400A Protection image

May 22, 2025
Littelfuse PSR072DL0400X is a high-speed 700V DC, 400A specialty fuse designed for battery storage, solar inverters, and industrial drives—ideal for circuit protection in critical DC systems.
12052845 Automotive Connectors by APTIV image

May 16, 2025
The 12052845 Automotive Connectors by APTIV offer durable, compact, and secure connections for vehicle systems, ideal for OEMs and EV/ICE applications in harsh automotive environments.
1N5060TR Rectifiers by Vishay – 600V Diode for Power image

Jun 8, 2025
1N5060TR Rectifiers by Vishay offer 600V reverse voltage, 1.5A current, and 50A surge protection in a DO-204AL package—perfect for power supplies and rectifier circuits.
HRC0524S6K0N – XP Power 6A Non-Isolated DC Converter image

May 28, 2025
XP Power HRC0524S6K0N is a 6A non-isolated DC/DC converter with 0.8–2.75V adjustable output and up to 95% efficiency—perfect for embedded, telecom, and industrial systems.

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON Electronics
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2025  X-ON Electronics Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing. All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted AS9120 Certified