X-On Electronics has gained recognition as a prominent supplier of W947D2HBJX5I DRAM across the USA, India, Europe, Australia, and various other global locations. W947D2HBJX5I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W947D2HBJX5I Winbond

W947D2HBJX5I electronic component of Winbond
W947D2HBJX5I Winbond
W947D2HBJX5I DRAM
W947D2HBJX5I  Semiconductors

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See Product Specifications
Part No. W947D2HBJX5I
Manufacturer: Winbond
Category: DRAM
Description: DRAM 128Mb LPDDR, x32, 200MHz, Industrial Temp
Datasheet: W947D2HBJX5I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 8.316
10 : USD 3.0564
25 : USD 2.9916
50 : USD 2.97
100 : USD 2.7108
240 : USD 2.7
480 : USD 2.6244
N/A

Obsolete
   
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We are delighted to provide the W947D2HBJX5I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W947D2HBJX5I and other electronic components in the DRAM category and beyond.

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W947D6HB / W947D2HB 128Mb Mobile LPDDR TABLE OF CONTENTS 1. GENERAL DESCRIPTION .......................................................................................................... 4 2. FEATURES.................................................................................................................................. 4 3. PIN CONFIGURATION ................................................................................................................ 5 3.1 Ball Assignment: LPDDR X16 .......................................................................................................... 5 3.2 Ball Assignment: LPDDR X32 .......................................................................................................... 5 4. PIN DESCRIPTION ..................................................................................................................... 6 4.1 Signal Descriptions ........................................................................................................................... 6 4.2 Addressing Table ............................................................................................................................. 7 5. BLOCK DIAGRAM ...................................................................................................................... 8 5.1 Block Diagram .................................................................................................................................. 8 5.2 Simplified State Diagram .................................................................................................................. 9 6. FUNCTION DESCRIPTION ....................................................................................................... 10 6.1 Initialization .................................................................................................................................... 10 6.1.1 Initialization Flow Diagram ....................................................................................................................11 6.1.2 Initialization Waveform Sequence .........................................................................................................12 6.2 Register Definition .......................................................................................................................... 12 6.2.1 Mode Register Set Operation ................................................................................................................12 6.2.2 Mode Register Definition .......................................................................................................................13 6.2.3. Burst Length .........................................................................................................................................13 6.3 Burst Definition ............................................................................................................................... 14 6.4 Burst Type ...................................................................................................................................... 15 6.5 Read Latency ................................................................................................................................. 15 6.6 Extended Mode Register Description ............................................................................................. 15 6.6.1 Extended Mode Register Definition ......................................................................................................16 6.7 Status Register Read ..................................................................................................................... 16 6.7.1 SRR Register (A n:0 = 0) .....................................................................................................................17 6.7.2 Status Register Read Timing Diagram .................................................................................................18 6.8 Partial Array Self Refresh ............................................................................................................... 19 6.9 Automatic Temperature Compensated Self Refresh ....................................................................... 19 6.10 Output Drive Strength ................................................................................................................... 19 6.11 Commands ................................................................................................................................... 19 6.11.1 Basic Timing Parameters for Commands ...........................................................................................19 6.11.2 Truth Table - Commands ....................................................................................................................20 6.11.3 Truth Table - DM Operations ..............................................................................................................21 6.11.4 Truth Table - CKE ...............................................................................................................................21 6.11.5 Truth Table - Current State BANKn - Command to BANKn ...............................................................22 6.11.6 Truth Table - Current State BANKn, Command to BANKn .................................................................23 7. OPERATION.............................................................................................................................. 24 7.1. Deselect ........................................................................................................................................ 24 7.2. No Operation ................................................................................................................................. 24 7.2.1 NOP Command .....................................................................................................................................25 Publication Release Date:Jun,17, 2011 - 1 - Revision A01-003 W947D6HB / W947D2HB 128Mb Mobile LPDDR 7.3 Mode Register Set .......................................................................................................................... 25 7.3.1 Mode Register Set Command ...............................................................................................................25 7.3.2 Mode Register Set Command Timing ...................................................................................................26 7.4. Active ............................................................................................................................................ 26 7.4.1 Active Command ...................................................................................................................................26 7.4.2 Bank Activation Command Cycle ..........................................................................................................27 7.5. Read ............................................................................................................................................. 27 7.5.1 Read Command ....................................................................................................................................28 7.5.2 Basic Read Timing Parameters ............................................................................................................28 7.5.3 Read Burst Showing CAS Latency .......................................................................................................29 7.5.4 Read to Read ........................................................................................................................................29 7.5.5 Consecutive Read Bursts ......................................................................................................................30 7.5.6 Non-Consecutive Read Bursts ..............................................................................................................30 7.5.7 Random Read Bursts ............................................................................................................................31 7.5.8 Read Burst Terminate ...........................................................................................................................31 7.5.9 Read to Write ........................................................................................................................................32 7.5.10 Read to Pre-charge .............................................................................................................................32 7.5.11 Burst Terminate of Read .....................................................................................................................33 7.6 Write ............................................................................................................................................... 33 7.6.1 Write Command ....................................................................................................................................34 7.6.2 Basic Write Timing Parameters .............................................................................................................34 7.6.3 Write Burst (min. and max. tDQSS) ......................................................................................................35 7.6.4 Write to Write .........................................................................................................................................35 7.6.5 Concatenated Write Bursts ...................................................................................................................36 7.6.6 Non-Consecutive Write Bursts ..............................................................................................................36 7.6.7 Random Write Cycles ...........................................................................................................................37 7.6.8 Write to Read ........................................................................................................................................37 7.6.9 Non-Interrupting Write to Read .............................................................................................................37 7.6.10 Interrupting Write to Read ...................................................................................................................38 7.6.11 Write to Precharge ..............................................................................................................................38 7.6.12 Non-Interrupting Write to Precharge ...................................................................................................38 7.6.13 Interrupting Write to Precharge ...........................................................................................................39 7.7 Precharge ....................................................................................................................................... 39 7.7.1 Precharge Command ............................................................................................................................40 7.8 Auto Precharge .............................................................................................................................. 40 7.9 Refresh Requirements .................................................................................................................... 40 7.10 Auto Refresh ................................................................................................................................ 40 7.10.1 Auto Refresh Command ......................................................................................................................41 7.11 Self Referesh ................................................................................................................................ 41 7.11.1 Self Refresh Command .......................................................................................................................42 7.11.2 Auto Refresh Cycles Back-to-Back .....................................................................................................42 7.11.3 Self Refresh Entry and Exit .................................................................................................................43 7.12 Power Down ................................................................................................................................. 43 7.12.1 Power-Down Entry and Exit ................................................................................................................43 7.13 Deep Power Down........................................................................................................................ 44 Publication Release Date:Jun,17, 2011 - 2 - Revision A01-003

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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