W955D8MBYA6I TR Winbond

W955D8MBYA 32Mb HyperRAM Table of Contents- 1. FEATURES .................................................................................................................................................................................. 3 2. ORDER INFORMATION .............................................................................................................................................................. 3 3. BALL ASSIGNMENT.................................................................................................................................................................... 4 4. BALL DESCRIPTIONS ................................................................................................................................................................ 5 5. BLOCK DIAGRAM ....................................................................................................................................................................... 6 6. FUNCTIONAL DESCRIPTION ..................................................................................................................................................... 7 6.1 HyperBus Interface ........................................................................................................................................................ 7 7. HYPERBUS TRANSACTION DETAILS ..................................................................................................................................... 10 7.1 Command/Address Bit Assignments ............................................................................................................................ 10 7.2 Read Transactions ....................................................................................................................................................... 14 7.3 Write Transactions (Memory Array Write) .................................................................................................................... 16 7.4 Write Transactions without Initial Latency (Register Write) .......................................................................................... 18 8. MEMORY SPACE ...................................................................................................................................................................... 19 8.1 HyperBus Interface Memory Space addressing ........................................................................................................... 19 8.1.1 Density and Row Boundaries ......................................................................................................................... 19 9. REGISTER SPACE ................................................................................................................................................................... 20 9.1 HyperBus Interface Register Addressing ..................................................................................................................... 20 9.2 Register Space Access ................................................................................................................................................ 20 9.3 Device Identification Registers ..................................................................................................................................... 21 9.4 Configuration Register 0 .............................................................................................................................................. 22 9.4.1 Wrapped Burst ............................................................................................................................................... 23 9.4.2 Initial Latency ................................................................................................................................................. 23 9.4.3 Fixed Latency ................................................................................................................................................ 24 9.4.4 Drive Strength ................................................................................................................................................ 24 9.4.5 Deep Power Down ......................................................................................................................................... 24 9.5 Configuration Register 1 .............................................................................................................................................. 25 9.5.1 Partial Array Refresh ...................................................................................................................................... 25 9.5.2 Hybrid Sleep .................................................................................................................................................. 26 9.5.3 Refresh Multiplier Indicator ............................................................................................................................ 26 10. INTERFACE STATES ................................................................................................................................................................ 27 10.1 Power Conservation Modes ......................................................................................................................................... 27 10.1.1 Interface Standby ........................................................................................................................................... 27 10.1.2 Hybrid Sleep .................................................................................................................................................. 27 10.1.3 Deep Power Down ......................................................................................................................................... 28 11. ELECTRICAL SPECIFICATIONS .............................................................................................................................................. 29 11.1 Absolute Maximum Ratings ......................................................................................................................................... 29 11.2 Operating Ranges ........................................................................................................................................................ 29 11.2.1 Electrical Characteristics and Operating Conditions ...................................................................................... 29 11.2.2 Operating Temperature .................................................................................................................................. 29 11.2.3 IDD Characteristics ........................................................................................................................................ 29 11.2.4 Power-Up Initialization ................................................................................................................................... 31 11.2.5 Hardware Reset ............................................................................................................................................. 32 11.2.6 Capacitance Characteristics .......................................................................................................................... 32 The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond. Publication Release Date: Jun. 05, 2019 Revision: A01-001 - 1 - W955D8MBYA 12. TIMING SPECIFICATIONS ........................................................................................................................................................ 33 12.1 AC Input-Output Reference Waveform ........................................................................................................................ 33 12.2 AC Test Conditions ...................................................................................................................................................... 33 12.3 AC Characteristics ....................................................................................................................................................... 34 12.3.1 Read Transactions ......................................................................................................................................... 34 12.3.2 Write Transactions ......................................................................................................................................... 37 12.3.3 Hybrid Sleep Timings ..................................................................................................................................... 39 12.3.4 Deep Power down Timings ............................................................................................................................ 39 13. PACKAGE SPECIFICATION ..................................................................................................................................................... 40 14. REVISION HISTORY ................................................................................................................................................................. 41 The above information is the exclusive intellectual property of Winbond Electronics and shall not be disclosed, distributed or reproduced without permission from Winbond. Publication Release Date: Jun. 05, 2019 Revision: A01-001 - 2 -