XD293-16

XD293-16 DIP16 XL293-20 SOP20 The XD293-16 is assembled in a 16 lead plastic 600mA OUTPUT CURRENT CAPABILITY packaage which has 4 center pins connected to- PER CHANNEL gether and used for heatsinking 1.2A PEAK OUTPUT CURRENT (non repeti- The XL293-20 is assembled in a 20 lead surface tive) PER CHANNEL mount which has 8 center pins connected to- ENABLE FACILITY gether and used for heatsinking. OVERTEMPERATURE PROTECTION LOGICAL0 INPUT VOLTAGE UP TO 1.5 V (HIGH NOISE IMMUNITY) INTERNAL CLAMP DIODES DESCRIPTION The Device is a monolithic integrated high volt- age, high current four channel driver designed to accept standard DTL or TTL logic levels and drive inductive loads (such as relays solenoides, DC and stepping motors) and switching power tran- sistors. To simplify use as two bridges each pair of chan- nels is equipped with an enable input. A separate supply input is provided for the logic, allowing op- eration at a lower voltage and internal clamp di- odes are included. This device is suitable for use in switching appli- cations at frequencies up to 5 kHz. BLOCK DIAGRAM 1 XD293-16 DIP16 / XL293-20 SOP20 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V Supply Voltage 36 V S V Logic Supply Voltage 36 V SS V Input Voltage 7 V i V Enable Voltage 7 V en I Peak Output Current (100 s non repetitive) 1.2 A o P Total Power Dissipation at T = 90 C 4W tot pins T , T Storage and Junction Temperature 40 to 150 C stg j PIN CONNECTIONS (Top view) THERMAL DATA Symbol Decription DIP SO Unit R Thermal Resistance Junction-pins max. 14 C/W th j-pins R Thermal Resistance junction-ambient max. 80 50 (*) C/W th j-amb R Thermal Resistance Junction-case max. 14 th j-case (*) With 6sq. cm on board heatsink. 2