Product Information

ATCA-7360-MEM-4G

ATCA-7360-MEM-4G electronic component of Artesyn Embedded Technologies

Datasheet
DRAM Module DDR3 SDRAM 4Gbyte

Manufacturer: Artesyn Embedded Technologies
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 250.8321 ea
Line Total: USD 250.83

4 - Global Stock
Ships to you between
Fri. 24 May to Thu. 30 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

ATCA-7360-MEM-4G
Artesyn Embedded Technologies

1 : USD 250.8321

4 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

ATCA-7360-MEM-4G
Artesyn Embedded Technologies

1 : USD 255.9511

     
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Rad Hardened
Mounting
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ATCA-7365-CE AdvancedTCA Processor Blade Front page The Emerson Network Power ATCA-7365-CE is an Intel Architecture server blade that The ATCA-7365-CE processor offers scalable, high-performance computing power for tasks that store, process and blade is an ideal solution for forward large amounts of data for applications where reliability or bill-per-minute are data processing applications critical. It is based on open-standards AdvancedTCA (ATCA ) technology to provide requiring powerful server commercial IT applications with improved serviceability, power and space efficiency class processing performance, over typical rack mount server-based solutions. Interior page flexible mass storage and network options With two 4- or 6-core Intel Xeon processors from the E5600 series, the ATCA-7365- CE processor blade enables best-in-class compute performance in an ATCA form fac- n High performance Intel tor. The PICMG 3.1 compliant fabric interface provides 10 Gigabit Ethernet (10Gbps) Architecture processor blade capability for applications requiring higher network throughput in the backplane. n Two 4- or 6-core Intel Xeon Multiple network and storage I/O interfaces allow the integration into different processors, E5620 or E5645 network infrastructures such as data processing applications and the carrier enterprise (2.4 GHz) environment. Main memory configuration and mass storage options can be flexibly n Up to 96GB main memory configured providing a perfect fit to the applications needs. Hardware RAID 0 and 1 is supported for locally and external connected disk drives. n Fully supported by the ATCA- 736X RTM family n Hot-swappable hard disk with flexible choice of storage options n RAID 0/1 support n Multiple network and storage I/O connectivity n 10GbE ATCA fabric interface, PICMG 3.1 Option 1, 9 n Designed for Commercial ATCA in a temperature controlled environment n Multiple software packages including operating systemsFront page Interior page ATCA-7365-CE Block Diagram 6 DDR3 VLP DIMM Slots 6 DDR3 VLP DIMM Slots DDR3 DDR3 (up to 1333) (up to 1333) QPI RTM-ATCA-7360 5.86 GT/s 4-/6-Core 4-/6-Core Management, Intel Xeon Intel Xeon Control, Power Processor 5600 Processor 5600 Series Series 1x USB USB, IPMC, Control, Power QPI QPI 5.86 GT/s 5.86 GT/s Intel Zone 3 PCI Express x4 82576 1000 to Dual Base-T RTM PCI Express x4 1GbE (P30, P31, P32) PCI Express x4 Intel 5520 Chipset Intel I/O Hub 82576 1000 PCI Express x4 Dual Base-T 1GbE PCI Express x4 Intel 1000 82576 SAS/SATA (Update Channel) ESI Dual Base-T 1GbE Intel GbE (Update) GbE 1000 82572 Base-T GbE PCI Express x4 Intel I/O Controller Hub LSISAS ICH10R USB 2.0 1064E SAS 2x USB SAS 1 & 10 GbE Con. Intel Cntr. (Fabric) 82599 Zone 2 SATA USB Dual to PCI Express x8 10GbE VGA VGA Backplane Emb. Flash SPI Module (P20, P23) (opt.) SSD Disk PCIe (opt.) LPC Intel GbE (Base) 82576 Dual PCI Express x4 Flash 1 1GbE Serial COM FPGA Console Flash 2 -48V Hot-swappable On-board Power HDD 2.5FF Supplies and Zone 1 -48V Hot Swap Circuitry to Backplane IPMC IPMB-A (P10) IPMB-B Standard Networking Support Processor Complex The ATCA-7365-CE processor blade provides PICMG Both Intel Xeon processors are connected together 3.0 base interface connectivity in a dual star configu - via QPI interconnect to share memory resources. The ration using standard Gigabit Ethernet (GbE) technol- processors can access the entire I/O subsystem via the ogy. Intel 5520 chipset I/O hub. The I/O subsystem consists of: The PICMG 3.1 fabric interface features both dual Intel I/O Controller Hub ICH10R 10Gbps (Option 9) and dual 1Gbps (Option 1) Intel 82572 Gigabit Ethernet controller Ethernet capability. A further 1Gbps Ethernet Intel 82576 dual Gigabit Ethernet controllers backplane connection is available on the ATCA update Intel 82599 dual 10 Gigabit Ethernet controller channel. External network connectivity includes 10/100/1000Base-T Ethernet via RJ-45 connector on Intel 82580 dual 10 Gigabit Ethernet controller (on optional RTM) the blade faceplate. Several rear transition module (RTM) configurations support up to six additional Intel i350 quad Gigabit Ethernet controller (on 10/100/1000Base-T connections. optional RTM) LSI Logic LSISAS1064E SAS controller (on optional RTM) 2

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Artesyn Embedded Power
ARTESYN TECHNOLOGIES
Emerson / Artesyn Technologies
Emerson Network Power
EMERSON NETWORK PWR
EMERSON?NETWORK POWER

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