X-On Electronics has gained recognition as a prominent supplier of BGU8011X rf amplifier across the USA, India, Europe, Australia, and various other global locations. BGU8011X rf amplifier are a product manufactured by NXP. We provide cost-effective solutions for rf amplifier, ensuring timely deliveries around the world.

BGU8011X NXP

BGU8011X electronic component of NXP
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See Product Specifications
Part No.BGU8011X
Manufacturer: NXP
Category:RF Amplifier
Description: RF Amplifier GPS LNA evaluation board
Datasheet: BGU8011X Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 2.3507
10 : USD 0.8815
25 : USD 0.8024
100 : USD 0.6592
250 : USD 0.6165
500 : USD 0.545
1000 : USD 0.5407
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Technology
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Maximum Operating Temperature
Pd - Power Dissipation
Operating Supply Current
Packaging
Product
Brand
Isolation Db
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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BGU8011 1 2 6 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass Rev. 1 14 May 2013 Product data sheet 1. Product profile 1.1 General description The BGU8011 is a Low Noise Amplifier (LNA) for GNSS receiver applications, available in a small plastic 6-pin extremely thin leadless package. The BGU8011 requires one external matching inductor and one external decoupling capacitor. The BGU8011 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 16.3 dB gain at a noise figure of 0.65 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. 1.2 Features and benefits Covers full GNSS L1 band, from 1559 MHz to 1610 MHz Noise figure (NF) = 0.65 dB Gain 16.3 dB High input 1 dB compression point of 5 dBm High out of band IP3 of 7 dBm i Supply voltage 1.5 V to 3.1 V Optimized performance at a low supply current of 4.2 mA Power-down mode current consumption < 1 A Integrated temperature stabilized bias for easy design Requires only one input matching inductor and one supply decoupling capacitor Input and output DC decoupled ESD protection on all pins (HBM > 2 kV) Integrated matching for the output Available in a 6-pins leadless package 1.1 mm 0.9 mm 0.47 mm 0.4 mm pitch: SOT1230 180 GHz transit frequency - SiGe:C technology Moisture sensitivity level of 1 1.3 Applications LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature phones, tablet PCs, digital still cameras, digital video cameras, RF front-end modules, complete GNSS modules and personal health applications.BGU8011 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 1.4 Quick reference data Table 1. Quick reference data f = 1575 MHz V = 2.85 V V 0.8 V P < 40 dBm T =25 C input matched to 50 CC I(ENABLE) i amb using a 5.6 nH inductor, see Figure 1 unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 1.5 - 3.1 V CC I supply current - 4.4 - mA CC G power gain no jammer - 16.3 - dB p 1 NF noise figure no jammer -0.65- dB P input power at 1 dB gain compression - 5- dBm i(1dB) 2 IP3 input third-order intercept point -7- dBm i 1 PCB losses are subtracted. 2 f = 1713 MHz f = 1851 MHz P = 20 dBm per carrier. 1 2 i 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1GND 2V CC 3RF OUT 4GND RF 5RF IN DDD 6 ENABLE Transparent top view 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGU8011 XSON6 plastic very thin small outline package no leads SOT1230 6 terminals body 1.1 0.9 0.47 mm OM7841 EVB BGU8011 evaluation board, MMIC only - OM7842 EVB BGU8011 evaluation board, front-end EVB - 4. Marking Table 4. Marking codes Type number Marking code BGU8011 C BGU8011 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved. Product data sheet Rev. 1 14 May 2013 2 of 19

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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