BM92A56MWV-ZE2

Datasheet USB Type-C Power Delivery Controller BM92A56MWV-Z General Description Key Specifications BM92A56MWV-Z is a full function USB Type-C Power VBUS Voltage Range: 4.75 V to 20 V Delivery (PD) controller that supports USB Power Power Consumption at Sleep Power: 0.4 mW (Typ) Delivery using baseband communication. Operating Temperature Range: -30 C to +105 C BM92A56MWV-Z includes support for the PD policy engine and communicates with an Embedded Controller Applications or the SoC via host interface. It supports SOP, SOP and Consumer Applications: SOP signaling, allowing it to communicate with cable Monitors, Docking Stations, TVs, STBs marker ICs, support alternate modes. Powerbank, USB Charger Features Package W(Typ) x D(Typ) x H(Max) USB Type-C Specification Compatible UQFN40V5050A 5.00 mm x 5.00 mm x 1.00 mm USB PD Specification Compatible (BMC-PHY) Two Power Path Control using N-ch MOSFET Drivers with Back Flow Prevention Type-C Cable Orientation Detection Built-in VCONN Switch and VCONN Controller Direct VBUS Powered Operation Supports DFP/UFP/DRP mode Supports Dead Battery Operation SMBus Interface for Host Communication EC-less Operation (Auto mode) Typical Application Circuit Power Supply For Prov VBUS (5 V to 20 V) Power Supply For Prov (5 V) VDDIO (1.8 V to 5 V) VDDIO VCONN (5 V) VCONN IN SMDATA Ext- CC1 SMCLK CC1 MCU VDDIO CC2 GPIO0(DOUT1) CC2 GPIO1(ALERT ) USB Type-C GPO2/VDIV(PDOTBL1) GPO3/FB(PDOTBL2) Receptacle XCLPOFF1 BM92A56MWV-Z DC/DC Control XCLPOFF2 GPIO7(DOUT4) UQFN40V5050A GPIO6(DOUT3) GPIO5(DOUT2) GPIO4 For D+ DBGMODDT BC1.2 VCCIN VDDIO DCP D- DBGRSTCK IDSEL/ATST1 VSTR/ATST2 XRST VCCIN GND Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0232AH500640-1-2 2017 ROHM Co., Ltd. All rights reserved. 1/27 TSZ22111 14 001 19.Jan.2018 Rev.002 VSVR CSENSEN VEX CSENSEP S2 DRV G2 VCCIN S2 DRV SRC LDO15ACAP S2 DRV G1 LDO28CAP S1 DRV G2 LDO15DCAP S1 DRV SRC GND S1 DRV G1 GND GND VB EXP-PAD DSCHGBM92A56MWV-Z Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Key Specifications ........................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Package W (Typ) x D(Typ) x H(Max) ..................................................................................................................................... 1 Typical Application Circuit ............................................................................................................................................................... 1 Contents ......................................................................................................................................................................................... 2 Notation .......................................................................................................................................................................................... 3 Reference ....................................................................................................................................................................................... 3 Pin Configuration ............................................................................................................................................................................ 4 Pin Descriptions .............................................................................................................................................................................. 5 Block Diagram ................................................................................................................................................................................ 6 Absolute Maximum Ratings (Ta=25 C) .......................................................................................................................................... 7 (Note 3) Thermal Resistance ............................................................................................................................................................... 7 Recommended Operating Conditions ............................................................................................................................................. 8 Electrical Characteristics................................................................................................................................................................. 8 1. Internal Memory Cell Characteristics .............................................................................................................................. 8 2. Circuit Power Characteristics .......................................................................................................................................... 8 3. Digital Pin DC Characteristics ......................................................................................................................................... 9 4. Power Supply Management .......................................................................................................................................... 10 5. CC PHY ....................................................................................................................................................................... 12 6. Voltage Detection .......................................................................................................................................................... 14 7. VBUS Discharge ........................................................................................................................................................... 14 8. Power FET Gate Driver ................................................................................................................................................. 15 Timing Chart ................................................................................................................................................................................. 16 1. Power On Sequence (Non Dead Battery Operation)..................................................................................................... 16 2. Power On Sequence (Dead Battery Operation) ............................................................................................................ 16 3. Reset Timing ................................................................................................................................................................. 17 4. Power Off Sequence ..................................................................................................................................................... 17 Application Example ..................................................................................................................................................................... 18 Selection of Components Externally Connected ........................................................................................................................... 18 I/O Equivalence Circuit ................................................................................................................................................................. 19 Register Initial Values of BM92A56MWV-Z ................................................................................................................................... 22 Operational Notes ......................................................................................................................................................................... 23 1. Reverse Connection of Power Supply ........................................................................................................................... 23 2. Power Supply Lines ...................................................................................................................................................... 23 3. Ground Voltage ............................................................................................................................................................. 23 4. Ground Wiring Pattern .................................................................................................................................................. 23 5. Recommended Operating Conditions ........................................................................................................................... 23 6. Inrush Current ............................................................................................................................................................... 23 7. Operation Under Strong Electromagnetic Field ............................................................................................................. 23 8. Testing on Application Boards ....................................................................................................................................... 23 9. Inter-pin Short and Mounting Errors .............................................................................................................................. 24 10. Unused Input Pins ......................................................................................................................................................... 24 11. Regarding the Input Pin of the IC .................................................................................................................................. 24 12. Ceramic Capacitor ........................................................................................................................................................ 24 13. Area of Safe Operation (ASO) ...................................................................................................................................... 24 14. Over Current Protection Circuit (OCP) .......................................................................................................................... 24 Ordering Information ..................................................................................................................................................................... 25 Marking Diagrams ......................................................................................................................................................................... 25 Physical Dimension and Packing Information ............................................................................................................................... 26 Revision History ............................................................................................................................................................................ 27 www.rohm.com TSZ02201-0232AH500640-1-2 2017 ROHM Co., Ltd. All rights reserved. 2/27 TSZ22111 15 001 19.Jan.2018 Rev.002