ATS-51425K-C1-R0 Advanced Thermal Solutions

ATS-51425K-C1-R0 electronic component of Advanced Thermal Solutions
ATS-51425K-C1-R0 Advanced Thermal Solutions
ATS-51425K-C1-R0 Heat Sinks
ATS-51425K-C1-R0
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of ATS-51425K-C1-R0 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-51425K-C1-R0 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. ATS-51425K-C1-R0
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, T412, 42.5x42.5x14.5mm, 72.8mm Fin Tip
Datasheet: ATS-51425K-C1-R0 Datasheet (PDF)
Price (USD)
1: USD 17.5959 ea
Line Total: USD 17.6 
Availability : 24
  
Ship by Thu. 09 Oct to Mon. 13 Oct
QtyUnit Price
1$ 17.5959
4$ 17.0226
5$ 16.4934
10$ 16.3905

Availability 24
Ship by Thu. 09 Oct to Mon. 13 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 17.5959
4$ 17.0226
5$ 16.4934
10$ 16.3905

   
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Product Category
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Factory Pack Quantity :
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ATS-51425K-C1-R0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-51425K-C1-R0 and other electronic components in the Heat Sinks category and beyond.

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The ATS-51425K-C1-R0 is a complete heat sink solution for BGA packages that are up to 42.5x42.5x14.5mm in size. It features a maxiFLOW baseplate that is designed for maximum heat transfer, as well as a low-profile maxiGRIP attachment system for easy installation. The heat sink also has a T412 thermal pad for improved heat dissipation and retention, with 72.8 mm fin tips for increased airflow and increased cooling. The C1-R0 specification indicates that the attached thermal pad is of type D, which refers to high-temp silicone grease, with a rated melt temperature between +105°C and +127°C. The high-grade aluminum construction of the ATS-51425K-C1-R0 also helps ensure durability in demanding environments.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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