X-On Electronics has gained recognition as a prominent supplier of ASFC4G31M-51BIN eMMC across the USA, India, Europe, Australia, and various other global locations. ASFC4G31M-51BIN eMMC are a product manufactured by Alliance Memory. We provide cost-effective solutions for eMMC, ensuring timely deliveries around the world.

ASFC4G31M-51BIN Alliance Memory

ASFC4G31M-51BIN electronic component of Alliance Memory
ASFC4G31M-51BIN Alliance Memory
ASFC4G31M-51BIN eMMC
ASFC4G31M-51BIN Semiconductors

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See Product Specifications
Part No. ASFC4G31M-51BIN
Manufacturer: Alliance Memory
Category: eMMC
Description: eMMC 4GB 32GB X 1 NAND - 3V - 153 Ball FBGA
Datasheet: ASFC4G31M-51BIN Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 8.652 ea
Line Total: USD 8.65 
Availability - 1970
Ship by Tue. 03 Jun to Thu. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 ASFC4G31M-51BIN More Buying Options & Price Grid(s)

Availability Price Quantity
1970
Ship by Tue. 03 Jun to Thu. 05 Jun
MOQ : 1
Multiples : 1
1 : USD 8.652
10 : USD 7.403
25 : USD 7.271
50 : USD 7.095
100 : USD 6.919
250 : USD 6.908
1120 : USD 6.886

Specifications

   
Manufacturer
Product Category
Memory Size
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ASFC4G31M-51BIN from our eMMC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ASFC4G31M-51BIN and other electronic components in the eMMC category and beyond.

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Additional Infomation About Product

ASFC4G31M-51BIN Revision History 4GB eMMC 153ball FBGA PACKAGE Revision Details Date Rev 1.0 Initial Release Dec. 2021 Confidential -139- Rev.1.0 December 2021ASFC4G31M-51BIN CONTENTS 1 Product Overview ............................................................................................................................................ 5 1.1 Product Description .................................................................................................................................................... 5 1.2 Product Ordering Information .................................................................................................................................. 5 1.3 Key Features ................................................................................................................................................................ 6 2 Package Information ........................................................................................................................................ 7 2.1 Package Dimension ..................................................................................................................................................... 7 2.2 Ball & Signal Assignment ............................................................................................................................................. 8 2.3 Product Architecture ................................................................................................................................................. 10 3 Technical Notes .............................................................................................................................................. 11 3.1 HS400 Interface ......................................................................................................................................................... 11 3.2 Partition Management .............................................................................................................................................. 11 3.2.1 Boot Area Partition and RPMB Area Partition ................................................................................................... 11 3.2.2 Enhanced Partition (Area) .................................................................................................................................. 12 3.2.3 User Density ....................................................................................................................................................... 12 3.3 Boot operation .......................................................................................................................................................... 12 3.4 Field Firmware Upgrade (FFU) .................................................................................................................................. 14 3.5 Cache ......................................................................................................................................................................... 14 3.6 Packed Commands .................................................................................................................................................... 14 3.7 Secure Delete ............................................................................................................................................................ 14 3.7.1 Sanitize ............................................................................................................................................................... 14 3.7.2 Secure Erase ....................................................................................................................................................... 14 3.7.3 Secure Trim ........................................................................................................................................................ 14 3.8 High Priority Interrupt (HPI) ...................................................................................................................................... 15 3.9 Device Health ............................................................................................................................................................ 15 3.10 Auto Power Saving Mode ........................................................................................................................................ 15 3.11 Enhanced Strobe ..................................................................................................................................................... 16 3.12 Performance ........................................................................................................................................................... 16 4 Register Value ................................................................................................................................................. 17 4.1 OCR Register ............................................................................................................................................................. 17 4.2 CID Register ............................................................................................................................................................... 17 4.2.1 Product name table (In CID Register) ................................................................................................................. 18 4.3 RCA Register .............................................................................................................................................................. 19 4.4 CSD Register .............................................................................................................................................................. 19 Confidential -239- Rev.1.0 December 2021

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

ACM may also be referenced as

ALLIANCE MEMORY, INC.
ALLIANCE SEMI

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