Product Information

HMC-XDB112

HMC-XDB112 electronic component of Analog Devices

Datasheet
Signal Conditioning GaAs MMIC x2 Active freq mult, 10-15 GHz

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

25: USD 55.4134 ea
Line Total: USD 1385.34

0 - Global Stock
MOQ: 25  Multiples: 25
Pack Size: 25
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 25
Multiples : 25

Stock Image

HMC-XDB112
Analog Devices

25 : USD 55.4134
50 : USD 53.6832
100 : USD 52.8055

     
Manufacturer
Product Category
Product Type
Product
Frequency
Frequency Range
Termination Style
Package / Case
Series
Packaging
Type
Brand
Rohs Mouser
Cnhts
Hts Code
Mxhts
Factory Pack Quantity :
Subcategory
Taric
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
102781-HMC272AMS8 electronic component of Analog Devices 102781-HMC272AMS8

- HMC272AMS8E Mixer 1.7GHz ~ 3GHz Evaluation Board
Stock : 0

104991-HMC327MS8G electronic component of Analog Devices 104991-HMC327MS8G

Analog Devices Hittite RF Development Tools Eval PCB
Stock : 0

105706-HMC384LP4 electronic component of Analog Devices 105706-HMC384LP4

Analog Devices Hittite Clock & Timer Development Tools Eval PCB
Stock : 0

105706-HMC506LP4 electronic component of Analog Devices 105706-HMC506LP4

Analog Devices Hittite Clock & Timer Development Tools Eval PCB
Stock : 0

107384-HMC493LP3 electronic component of Analog Devices 107384-HMC493LP3

RF Development Tools HMC493LP3 Evaluation PCB
Stock : 0

107755-HMC454ST89 electronic component of Analog Devices 107755-HMC454ST89

Sub-GHz Development Tools HMC454ST89 Evaluation PCB, 900 MHz
Stock : 0

108190-HMC591LP5 electronic component of Analog Devices 108190-HMC591LP5

RF Development Tools HMC591LP5 Evaluation PCB
Stock : 0

106137-HMC370LP4 electronic component of Analog Devices 106137-HMC370LP4

Analog Devices Hittite RF Development Tools Eval PCB
Stock : 0

106137-HMC443LP4 electronic component of Analog Devices 106137-HMC443LP4

RF Development Tools HMC443LP4 Evaluation PCB
Stock : 0

109266-HMC550A electronic component of Analog Devices 109266-HMC550A

RF Development Tools HMC550A EVALUATION PCB ASSEMBLY
Stock : 0

Image Description
FAR-F6KB-2G1400-B4GC-Z electronic component of Taiyo Yuden FAR-F6KB-2G1400-B4GC-Z

Signal Conditioning SAW FLTR W-CDMA I (2G) RX 1410 BAL
Stock : 1

FI212C245034-T electronic component of Taiyo Yuden FI212C245034-T

Signal Conditioning BANDPASS FLTR HI FREQ MULTILYR
Stock : 0

FI212C245041-T electronic component of Taiyo Yuden FI212C245041-T

Signal Conditioning BALNCD BNDPASS FLTR HI FREQ MULTILYR
Stock : 0

FI212C245072-T electronic component of Taiyo Yuden FI212C245072-T

Signal Conditioning BANDPASS FLTR HI FREQ MULTILYR
Stock : 1

SF2133E electronic component of Murata SF2133E

Signal Conditioning 1745.5 MHz BW=75MHz
Stock : 1

FAR-F6KB-1G9600-B4GB-Z electronic component of Taiyo Yuden FAR-F6KB-1G9600-B4GB-Z

Signal Conditioning SAW FLTR GSM1900 RX 1410 BAL
Stock : 1

FI212C245031-T electronic component of Taiyo Yuden FI212C245031-T

Signal Conditioning BALANCED BANDPASS FLTR 2.4GHZ
Stock : 1

FI212C245032-T electronic component of Taiyo Yuden FI212C245032-T

Signal Conditioning BALNCD BNDPASS FLTR HI FREQ MULTILYR
Stock : 0

RFBPF1608060AA7M1U electronic component of Walsin RFBPF1608060AA7M1U

EMI/RFI Filters (LC, RC Networks) SMD,1.6x0.8x0.6mm RoHS
Stock : 1

SFRG00FBB02 electronic component of WISOL SFRG00FBB02

QFN-10(1.1x1.5) SAW Filters ROHS
Stock : 0

HMC-XDB112 v00.0907 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT Typical Applications Features Conversion Loss: 13 dB This HMC-XDB112 is ideal for: Passive: No DC Bias Required Point-to-Point Radios 2 Input Drive: +13 dBm VSAT High Fo Isolation: 30 dB Test Instrumentation Die Size: 2.2 x 0.65 x 0.1 mm Military & Space Clock Generation General Description Functional Diagram The HMC-XDB112 is a monolithic Passive Frequency Doubler which utilizes GaAs Heterojunction Bipolar Transistor (HBT) technology, and is targeted to high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized and the HBT devices are fully passivated for reliable operation. The HMC-XDB112 Passive Doubler MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes. Electrical Specifi cations*, T = 25 C, Pin = +13 dBm A Parameter Min. Typ. Max. Units Frequency Range Input 10 - 15 GHz Frequency Range Output 20 - 30 GHz Conversion Loss 13 dB Fo Isolation with respect to output 30 dB *Unless otherwise indicated, all measurements are from probed die Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, and to place orders: Analog Devices, Inc., For price, delivery, and to place orders, please contact Hittite Microwave Corporation: responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Phone: 781-329-4700 Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. 2 - 68 Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 1-800-ANALOG-D Order On-line at www.hittite.com FREQUENCY MULTIPLIERS - PASSIVE - CHIPHMC-XDB112 v00.0907 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT Output Power Conversion Loss 0 5 0 -2 -5 2 -4 -10 -6 -15 Fin -8 2xFin -20 -10 -25 -12 -30 -14 -35 -16 -40 -18 -45 -20 -50 10 11 12 13 14 15 10 11 12 13 14 15 FREQUENCY (GHz) INPUT FREQUENCY (GHz) Outline Drawing ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1 Die Packaging Information 1. ALL DIMENSIONS ARE IN INCHES MM . 2. TYPICAL BOND PAD IS .004 SQUARE. Standard Alternate 3. BACKSIDE METALLIZATION: GOLD. WP-4 (Waffle Pack) 2 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 1 Refer to the Packaging Information section for die 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. packaging dimensions. 7. OVERALL DIE SIZE .002 2 For alternate packaging information contact Hittite Microwave Corporation. Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, and to place orders: Analog Devices, Inc., For price, delivery, and to place orders, please contact Hittite Microwave Corporation: responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Phone: 781-329-4700 Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. 2 - 69 Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 1-800-ANALOG-D Order On-line at www.hittite.com CONVERSION LOSS (dB) OUTPUT POWER (dBm) FREQUENCY MULTIPLIERS - PASSIVE - CHIP

Tariff Desc

8504.50.10 Electrical transformers, static converters (for example, rectifiers) and inductors.

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted