5082-0012 PIN Diode Chip for Hybrid MIC Switches/Attenuators Data Sheet Description Features This PIN diode chip is silicon dioxide or nitride passivated. Low Series Resistance: 1.0 Typical The 5082-0012 has a planar construction. The fabrication Applications processes are optimized for long term reliability and tight- ly controlled for uniformity in electrical performance. This general purpose PIN diode is intended for low power switching applications such as duplexers, antenna switch- Outline ing matrices, digital phase shifters, time multiplex fi lters, TR switches, pulse and amplitude modulators, limiters, DIMENSIONS D leveling circuits, and attenuators. 0.10 D 0.03 (1) (4) X Maximum Ratings 0.38 X 0.05 (2) (15) Junction Operating and Storage 0.23 Y 0.03 (1) (9.0) Temperature Range -65C to +150C Top Contact Au. Cathode X Bottom Contact Au. Anode Soldering Temperature +425C for 1 min. max. Dimensions in millimeters Y (1/1000 inch) Electrical Specifi cations at T = 25C Typical Parameters A Nearest Typical Chip Equivalent Minimum Maximum Typical Reverse Part Packaged Breakdown Junction Series Typical Recovery Number Part No. Voltage Capacitance Resistance Lifetime Time 5082- 5082- V (V) C (pF) R () (ns) t (ns) BR j S rr 0012 3001 150 0.12 1.0 400 100 Test V = V V = 50 V I = 100 mA I = 50 mA I = 20 mA R BR R F F F Conditions Measure f = 1 MHz f = 100 MHz I = 250 mA V = 10 V R R I 10 mA 90% Recovery RAssembly and Handling Procedures for PIN Chips 1. Storage 3. Die Attach Devices should be stored in a dry nitrogen purged des- a. Eutectic sicator or equivalent. AuSn preform with stage temperature of 310C for one minute max. AuGe preform with stage tempera- 2. Cleaning ture of 390C for one minute max. If required, surface contamination may be removed with electronic grade solvents. Typical solvents, such b. Epoxy as freon (T.F. or T.M.C.), acetone, deionized water, and For epoxy die-attach, conductive silver-fi lled or methanol, or their locally approved equivalents, can goldfi lled epoxies are recommended. This method be used singularly or in combinations. Typical cleaning can be used for all Avago PIN chips. times per solvent are one to three minutes. DI water 4. Wire Bonding and methanol should be used (in that order) in the fi - Either ultrasonic or thermocompression bonding tech- nal cleans. Final drying can be accomplished by plac- niques can be employed. Suggested wire is pure gold, ing the cleaned dice on clean fi lter paper and drying 0.7 to 1.5 mil diameter. with an infrared lamp for 5-10 minutes. Acids such as hydrofl uoric (HF), nitric (HNO3) and hydrochloric (HCl) should not be used. The eff ects of cleaning methods/solutions should be verifi ed on small samples prior to submitting the entire lot. Following cleaning, dice should be either used in as- sembly (typically within a few hours) or stored in clean containers in a reducing atmosphere or a vacuum chamber. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4778EN AV02-3802EN - September 12, 2012