Product Information

ATF-511P8-BLK

ATF-511P8-BLK electronic component of Broadcom

Datasheet
RF JFET Transistors Transistor GaAs High Linearity

Manufacturer: Broadcom
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1200
Multiples : 1200

Stock Image

ATF-511P8-BLK
Broadcom

1200 : USD 3.7733
2600 : USD 3.5122
12000 : USD 3.3816
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1

Stock Image

ATF-511P8-BLK
Broadcom

1 : USD 7.7737
25 : USD 5.9538
100 : USD 4.6521
250 : USD 3.964
500 : USD 3.5482
1000 : USD 3.0371
2500 : USD 2.6635
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Transistor Type
Technology
Operating Frequency
Gain
Vds - Drain-Source Breakdown Voltage
Vgs - Gate-Source Breakdown Voltage
Id - Continuous Drain Current
Maximum Drain Gate Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Configuration
Product
Series
Type
Brand
Forward Transconductance - Min
Nf - Noise Figure
P1db - Compression Point
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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ATF-511P8 [1] High Linearity Enhancement Mode Pseudomorphic HEMT 2 [3] in 2x2 mm LPCC Package Data Sheet Description Features Avago Technologiess ATF-511P8 is a single-voltage high Single voltage operation linearity, low noise E-pHEMT housed in an 8-lead JEDEC- High linearity and P1dB [3] standard leadless plastic chip carrier (LPCC ) package. Low noise fi gure The device is ideal as a high linearity, low-noise, medium- power amplifi er. Its operating frequency range is from 50 Excellent uniformity in product specifi cations MHz to 6 GHz. Small package size: 2.0 x 2.0 x 0.75 mm The thermally effi cient package measures only 2 mm [2] x 2 mm x 0.75 mm. Its backside metalization provides Point MTTF > 300 years excellent thermal dissipation as well as visual evidence MSL-1 and lead-free of solder refl ow. The device has a Point MTTF of over 300 years at a mounting temperature of +85C. All devices Tape-and-reel packaging option available are 100% RF & DC tested. Specifi cations Notes: 2 GHz; 4.5V, 200 mA (Typ.) 1. Enhancement mode technology employs a single positive V , gs eliminating the need of negative gate voltage associated with 41.7 dBm output IP3 conventional depletion mode devices. 2. Refer to reliability datasheet for detailed MTTF data. 30 dBm output power at 1 dB gain compression 3. Conforms to JEDEC reference outline MO229 for DRP-N. 1.4 dB noise fi gure 4. Linearity Figure of Merit (LFOM) is essentially OIP3 divided by DC bias power. 14.8 dB gain [4] 12.1 dB LFOM Pin Connections and Package Marking 69% PAE Pin 8 Pin 1 (Source) Pin 7 (Drain) Pin 2 (Gate) Applications Pin 6 Pin 3 Front-end LNA Q2 and Q3 driver or pre-driver amplifi er Pin 5 Pin 4 (Source) for Cellular/PCS and WCDMA wireless infrastructure Bottom View Driver amplifi er for WLAN, WLL/RLL and MMDS applications Pin 1 (Source) Pin 8 General purpose discrete E-pHEMT for other high Pin 2 (Gate) Pin 7 (Drain) linearity applications 1Px Pin 3 Pin 6 Pin 4 (Source) Pin 5 Top View Note: Package marking provides orientation and identifi cation: 1P = Device Code x = Date code indicates the month of manufacture. Source (Thermal/RF Gnd)[1] ATF-511P8 Absolute Maximum Ratings Notes: Absolute 1. Operation of this device in excess of any one of these parameters may cause permanent Symbol Parameter Units Maximum damage. [2] 2. Assumes DC quiescent conditions. V DrainSource Voltage V 7 DS 3. Board (package belly) temperatureT is B [2] V Gate Source Voltage V -5 to 1 GS 25C. Derate 30 mW/C for T > 50C. B [2] 4. With 10 Ohm series resistor in gate supply V Gate Drain Voltage V -5 to 1 GD and 3:1 VSWR. [2] I Drain Current A 1 5. Channel-to-board thermal resistance DS measured using 150C Liquid Crystal I Gate Current mA 46 GS Measurement method. [3] P Total Power Dissipation W 3 6. Device can safely handle +30dBm RF Input diss Power provided I limited to 46mA. I at GS GS [4] P RF Input Power dBm +30 in max. P drive level is bias circuit dependent. 1dB T Channel Temperature C 150 CH T Storage Temperature C -65 to 150 STG [5] Thermal Resistance C/W 33 ch_b [6,7] Product Consistency Distribution Charts at 2 GHz, 4.5V, 200 mA 200 240 1000 0.8 V Cpk = 3.24 Cpk = 1.66 900 200 Stdev = 0.6 Stdev = 0.15 160 800 0.7 V 700 160 120 600 +3 Std -3 Std -3 Std +3 Std 500 120 0.6 V 400 80 80 300 200 40 40 0.5 V 100 0 0 0 02 4 6 8 35 38 41 44 47 28 29 30 31 OIP3 (dBm) P1dB (dBm) V (V) DS Figure 2. OIP3 LSL = 38.5, Nominal = 41.7. Figure 3. P1dB LSL = 28.5, Nominal = 30. Figure 1. Typical I-V Curves (V = 0.1 per step). gs 150 160 Cpk = 1.4 Cpk = 3.03 Stdev = 0.31 Stdev = 1.85 120 120 90 -3 Std +3 Std -3 Std +3 Std 80 60 40 30 0 0 13 14 15 16 17 52 57 62 67 72 77 82 GAIN (dB) PAE (%) Figure 4. Gain LSL = 13.5, Figure 5. PAE LSL = 52, Nominal = 68.9. Nominal = 14.8, USL = 16.5. Notes: 6. Distribution data sample size is 400 samples taken from 4 diff erent 7. Measurements are made on production test board, which represents a trade-off between optimal OIP3, P1dB and VSWR. Circuit losses wafers and 3 diff erent lots. Future wafers allocated to this product may have nominal values anywhere between the upper and lower have been de-embedded from actual measurements. limits. 2 I (mA) DS

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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Broadcom Limited
PLX Technology Avago
PLX Technology / Avago

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