DFLZ5V1Q - DFLZ39Q 
 
 
Green 
1.0W SURFACE MOUNT POWER ZENER DIODE  
POWERDI 123  
 
 
Features Mechanical Data 
 
 1W Power Dissipation on FR-4 PCB  Case: POWERDI123 
 Large, exposed pad and heat sink designed for superior thermal  Case Material: Molded Plastic, Green Molding Compound.  
performance UL Flammability Classification Rating 94V-0 
 Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Moisture Sensitivity: Level 1 per J-STD-020 
 Halogen and Antimony Free. Green Device (Note 3)   Terminal Connections: Cathode Band 
 Qualified to AEC-Q101 Standards for High Reliability  Terminals: Finish - Matte Tin Annealed over Copper Leadframe.  
 Patented Interlocking Clip Design for High Surge Capacity, US Solderable per MIL-STD-202, Method 208  
 
Patent #7,095,113  Weight: 0.01 grams (Approximate) 
 
 
 
 
 
 
 
 
 
 
 
Top View 
 
 
 
Ordering Information (Note 4) 
Part Number Qualification Case Packaging 
Automotive 
(Type Number)Q-7* POWERDI 123 3,000/Tape & Reel 
*   Add -7 to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = DFLZ6V2Q-7 
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 
 2. See  
 
DFLZ5V1Q - DFLZ39Q 
 
 
 
 
Maximum Ratings (@T = +25C, unless otherwise specified.)  
A
Characteristic Symbol Value Unit 
Forward Voltage @ I = 200mA V 1.2 V 
F F
 
 
 
 
 
Thermal Characteristics    
Characteristic Symbol Typ Value Unit 
Power Dissipation (Note 5) P  1.0 W 
D
Thermal Resistance Junction to Ambient Air (Note 5) 110  C/W 
R 
JA
Thermal Resistance Junction to Soldering Point (Note 6)  9 C/W 
R 
JS
Operating and Storage Temperature Range T , T  -55 to +150 C 
J STG 
 
 
 
 
 
Electrical Characteristics (@T = +25C, unless otherwise specified.) 
A
Maximum Reverse 
Temperature 
Zener Voltage Range  Zener Impedance 
Current 
Coefficient  
(Note 7) 
(Note 8) 
Type Marking 
(Note 7) 
@ I
ZTC 
Number Codes 
%/ C 
V @ I I Z @ I I @ V 
Z ZT ZT ZT  ZT R R
Nom (V) Min (V) Max (V) mA Typ () Max () A V Min Max 
DFLZ5V1Q FHK 5.1 4.8 5.4 100 2 6 2.5 1 -0.08 -0.2 
DFLZ5V6Q FHL 5.6 5.2 6.0 100 1 4 10 2 -0.04 0.04 
DFLZ6V2Q FHN 6.2 5.8 6.6 100 1 3 5 2 -0.01 0.06 
DFLZ6V8Q FHO 6.8 6.4 7.2 100 1 3 5 3 0 0.07 
DFLZ7V5Q FHQ 7.5 7.0 7.9 100 1 2 5 3 0 0.07 
DFLZ8V2Q FHR 8.2 7.7 8.7 100 1 2 5 3 0.03 0.08 
DFLZ9V1Q FHT 9.1 8.5 9.6 50 1 4 5 5 0.03 0.08 
DFLZ10Q FHU 10 9.4 10.6 50 1 4 5 7.5 0.05 0.09 
DFLZ11Q FHV 11 10.4 11.6 50 1 7 4 8.2 0.05 0.10 
DFLZ12Q FHW 12 11.4 12.7 50 1 7 3 9.1 0.05 0.10 
DFLZ13Q FHX 13 12.4 14.1 50 1 10 2 10 0.05 0.10 
DFLZ15Q FHZ 15 13.8 15.6 50 1 10 1 11 0.05 0.10 
DFLZ16Q FJA 16 15.3 17.1 25 1 15 1 12 0.06 0.11 
DFLZ18Q FJF 18 16.8 19.1 25 2 15 1 13 0.06 0.11 
DFLZ20Q FJG 20 18.8 21.2 25 3 15 1 15 0.06 0.11 
DFLZ22Q FJK 22 20.8 23.3 25 3 15 1 16 0.06 0.11 
DFLZ24Q FJL 24 22.8 25.6 25 2 15 1 18 0.06 0.11 
DFLZ27Q FJN 27 25.1 28.9 25 3 15 1 20 0.06 0.11 
DFLZ30Q FJQ 30 28 32 25 8 15 1 22 0.06 0.11 
DFLZ33Q FJR 33 31 35 25 5 15 1 24 0.06 0.11 
DFLZ36Q FJS 36 34 38 10 5 40 1 27 0.06 0.11 
DFLZ39Q FJT 39 37 41 10 5 40 1 30 0.06 0.11 
Notes: 5. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf at