REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 91-11-26 Ray Monnin A Changes in accordance with NOR 5962-R076-92. 93-0217 M. A. Frye B Redrawn with changes. Add devices 05 through 09. Add vendor CAGE number 6Y440 to device types 01 through 04, N package only, device types 05 through 09 X,Y,T, U and N. Add vendor CAGE number 04713 to device types 02,03, and 04, X package only. Add vendor CAGE number 65786 to device types 03 through 06 packages X, Y, U, N, and M, and to device types 07 and 08, packages Y, U, N, and M. Add vendor CAGE number 61772 to devices 05 and 06, packages X, Y, M, N and U. Add vendor CAGE number 0K6N4 to device types 03 through 08 packages Y,U,N, and M. Remove vendor CAGE numbers 0BK02 and 0BYV4 from the drawing. Editorial changes throughout. 95-04-14 M. A. Frye C Changes in accordance with NOR 5962-R098-95 07-10-02 Robert M. Heber D Boilerplate update, part of 5 year review. ksr THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth S. Rice DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88662 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 32K X 8 CMOS SRAM 100 ns 02 70 ns 03 55 ns 04 45 ns 05 35 ns 06 25 ns 07 20 ns 08 15 ns 09 12 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual in-line Y CQCC1-N32 32 Rectangular leadless chip carrier Z CDFP3-F28 28 Flat pack U CQCC3-N28 28 Rectangular leadless chip carrier T CDFP4-F28 28 Flat pack N CDIP3-T28 or GDIP4-T28 28 Dual in-line M GDFP2-F28 28 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (V ) --------------------------------------- -0.5 V dc to +7.0 V dc 2/ CC Input voltage range ------------------------------------------------- -0.5 V dc to +6.0 V dc Ambient storage temperature ------------------------------------ -65 C to +150C Thermal resistance, junction-to-case ( ) ------------------ See MIL-STD-1835 JC Junction temperature (T ) ----------------------------------------- +150C 3/ J Power dissipation --------------------------------------------------- 1.0 W Lead temperature (soldering, 10 seconds)-------------------- +260C 1.4 Recommended operating conditions. Supply voltage range (V ) -------------------------------------- 4.5 V dc to 5.5 V dc 2/ CC Ground voltage (V ) ---------------------------------------------- 0 V dc SS Input high voltage range (V ) ----------------------------------- 2.2 V dc to V +0.5 V dc IH CC Input low voltage range (V ) ------------------------------------- -0.5 V dc to 0.8 V dc IL Operating case temperature (T ) ------------------------------- -55C to +125C C 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin and will also be listed in MIL-HDBK-103. 2/ All voltages referenced to V . SS 3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. SIZE STANDARD A 5962-88662 MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 D 2 DSCC FORM 2234 APR 97