REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R232-93 93-09-21 Michael A. Frye B Drawing updated to reflect current requirements. Removed 00-11-02 Raymond Monnin programming logic from truth table B. Editorial changes throughout. - gap 5 year review and update. Changed input capacitance from 6 pF to C 06-06-12 Raymond Monnin 10 pF. ksr THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Steve Duncan DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Ray Monnin 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88734 01 J A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 7C291 2K X 8-bit PROM 55 ns 02 7C291 2K X 8-bit PROM 45 ns 03 7C291 2K X 8-bit PROM 35 ns 04 7C291 2K X 8-bit PROM 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line package K GDFP2-F24 or CDFP3-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (V ) ..................................................................... +4.5 V dc to +5.5 V dc CC Storage temperature range............................................................ -65C to +150C Voltage on any pin with respect to ground ..................................... -0.6 V dc to +7.0 V dc V with respect to ground ............................................................ -0.6 V dc to +13.0 V dc PP Power dissipation (P ).................................................................... 550 mW 1/ D Lead temperature (soldering, 10 seconds) .................................... +300C Thermal resistance, junction-to-case ()..................................... See MIL-STD-1835 JC 1.4 Recommended operating conditions. Case operating temperature range (T ) ....................................... -55C to +125C C 1/ Must withstand the added P due to short-circuit test e.g., I . D OS SIZE STANDARD 5962-88734 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97