REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED Outline letter, Y, case outline changed to F-11 for standardization. A Michael A. Frye 88-01-19 Convert to military drawing format. Editorial changes throughout. Make change to table I, table II, 1.2. 2, 3. 3, and 4.3. Add figure 5. 89-04-04 B Michael A. Frye Editorial changes throughout. Make change to figure 4. Updated boilerplate. Added device type 02. Removed CAGE 34335 C 99-10-19 Raymond Monnin from drawing and added CAGE 0DKS7. - glg Added provisions for the addition of QD certified parts to drawing. 00-02-03 D Raymond Monnin Added CAGE OC7V7 as supplier. - glg E Corrected marking paragraph 3.5, updated boilerplate paragraphs. 05-04-01 Raymond Monnin ksr F Updated body of drawing to reflect current requirements. - glg 11-03-08 Charles Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED CURRENT CAGE CODE 67268 REV SHEET REV F F SHEET 15 16 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Sandra Rooney DLA LAND AND MARITIME CHECKED BY STANDARD COLUMBUS, OHIO 43218-3990 MICROCIRCUIT D. A. DiCenzo 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86025 01 X X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit 01 29705A 16-word by 4-bit, 2-port RAM, 30 ns 02 29705A-35 16-word by 4-bit, 2-port RAM, 35 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 dual-in-line package Y GDFP2-F28 28 flat package 3 CQCC1-N28 28 square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Storage temperature ...................................................... -65C to +150C Supply voltage to ground potential ................................. -0.5 V dc to +7.0 V dc DC voltage applied to outputs for high output stage ........ -0.5 V dc to +V maximum CC DC input voltage .............................................................. -0.5 V dc to +5.5 V dc DC output current, into outputs ........................................ 30 mA DC input current .............................................................. -30 mA to +5.0 mA Maximum power dissipation (P ) 1/ ............................... 1.155 mW D Lead temperature (soldering, 10 seconds) ..................... +300C Thermal resistance, junction-to-case ( ): ...................... See MIL-STD-1835 JC Junction temperature (T ) ................................................ +175C J 1.4 Recommended operating conditions. Supply voltage (V ) ...................................................... +4.5 V dc to +5.5 V dc CC Minimum high level input voltage (V ) ........................... +2.0 V dc IH Maximum low level input voltage (V ) ............................ +0.8 V dc IL Case operating temperature range (T ) ......................... -55C to +125C C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. 1/ Must withstand the added P due to short circuit test e.g., I . D OS SIZE STANDARD 86025 A MICROCIRCUIT DRAWING DLA LAND AND MARITIME REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 F 2 DSCC FORM 2234 APR 97