Effective June 2020 Technical Data 10427 Supersedes August 2015 FP1110V High frequency, high current power inductors Applications Multi-phase and Vcore regulators Voltage Regulator Modules (VRMs) Server and desktop Central processing unit (CPU Graphics processing unit (GPU)) Application specific integrated circuit (ASIC) High power density Data networking and storage systems Graphics cards and battery power systems Portable electronics Point-of-load modules Product features DCR sensing circuits Vertical design utilizes less board space Tight tolerance DCR for sensing circuits Environmental compliance and general Inductance Range from 150 nH to 320 nH specifications Current range from 42 A to 90 A Storage temperature range (Component): -40 C to +125 C 10.7 mm x 7.5 mm and 10.5 mm x 6.2 mm foot- print surface mount package in a 9.5 mm height Operating temperature range: -40 C to +125 C (ambient plus self-temperature rise) Ferrite core material Solder reflow temperature: J-STD-020 Moisture sensitivity level (MSL): 1 (latest revision) compliant HALOGEN HF Pb FREETechnical Data 10427 FP1110V Effective June 2020 High frequency, high current power inductors Product specifications 1 2 3 4 5 OCL FLL (nH) I I I DCR (m) rms sat1 sat2 7 6 Part number (nH) 10% minimum (A) (A) (A) 5% +20C K-factor V1 version FP1110V1-R15-R 150 108 61 90 72 0.23 278 FP1110V1-R20-R 195 140 61 70 58 0.23 278 FP1110V1-R22-R 220 158 61 64 51 0.23 278 FP1110V1-R27-R 270 173 61 55 44 0.23 278 FP1110V1-R32-R 320 230 61 42 34 0.23 278 V2 version FP1110V2-R150-R 150 108 61 89 70 0.18 328 FP1110V2-R180-R 180 130 61 72 57.5 0.18 328 FP1110V2-R200-R 200 144 61 65 52 0.18 328 FP1110V2-R220-R 220 159 61 59 47 0.18 328 FP1110V2-R270-R 270 195 61 48 38.5 0.18 328 FP1110V2-R320-R 320 230 61 40.5 32.5 0.18 328 1. Open circuit inductance (OCL) Test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 C 5. I : Peak current for approximately 20% rolloff +100 C sat -3 2. Full load inductance (FLL) Test parameters: 100 kHz, 0.1 Vrms, I 1, +25 C 6. K-factor: Used to determine B for core loss (see graph). B = K * L * I * 10 . sat p-p p-p 3. I : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. B :(Gauss), K: (K-factor from table), L: (Inductance in nH), I (Peak to peak ripple current in Amps). rms p-p PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 7. Part Number Definition: FP1110Vx-Rxx(x)-R temperature rise. It is recommended that the temperature of the part not exceed +125 C under worst case operating FP1110V = Product code conditions verified in the end application. x= Version indicator 4. I 1 : Peak current for approximately 20% rolloff +25 C Rxx(x)= Inductance value in uH, R= decimal point sat -R suffix = RoHS compliant Dimensions- mm 7.5 9.5 Recommended pad layout Schematic max max a 10.7 4.6 4.1 max b 2.8 3.4 2.8 3.3 Recommended pad layout Schematic 6.2 9.5 max max a 10.5 4.2 4.0 max b 3.0 3.6 2.15 2.8 Part marking: FP1110Vx (x=Version indicator), Rxx(x)=inductance value in H, R=decimal point xxxx= lot code DCR measured from point a to point b Soldering surfaces to be coplanar within 0.10 millimeters Traces or vias underneath the inductor is not recommended. 2 www.eaton.com/electronics xxxx xxxx