G2053 Global Mixed-mode Technology Dual H-Bridge Motor Driver Features General Description Dual H-Bridge Motor Driver With Current Control The G2053 provides a dual-bridge motor driver solu- - 1 or 2 DC Motors or 1 Stepper Motor tion for toys, printers, and other mechatronic applica- - Low On-Resistance: HS + LS = 1735m tions. (Typical, 25C) Output Current Capability (at V = 5V, 25C) M The device has two H-bridges and can drive two DC - TSSOP-16 (FD) Package brushed motors, a bipolar stepper motor, solenoids, or 0.7A RMS, 1A Peak per H-Bridge other inductive loads. 1.4A RMS in Parallel Mode - TQFN3X3-16 and TQFN4X4-16 Package Each H-bridge output consists of a pair of N-channel 0.6A RMS, 1A Peak per H-Bridge and P-channel MOSFETs, with circuitry that regulates 1.2A RMS in Parallel Mode the winding current. With proper PCB design, each Wide Power Supply Voltage Range 2.7 to 10.8V Integrated Current Regulation H-bridge of the G2053 can drive up to 700mA RMS (or Easy Pulse-Width-Modulation (PWM) Interface DC) continuously, at 25C with a V supply of 5V. The M 1.6A Low-Current Sleep Mode (at 5V) device can support peak currents of up to 1 A per TSSOP-16 (FD), TQFN3X3-16 and TQFN4X4-16 bridge. Current capability is reduced slightly at lower Package V voltages. M ProtectionFeatures V Undervoltage Lockout (UVLO) - M Internal shutdown functions with a fault output pin are - Overcurrent Protection (OCP) provided for overcurrent protection, short-circuit pro- - Thermal Shutdown (TSD) tection, UVLO, and overtemperature. A low-power - Fault Indication Pin (nFAULT) sleep mode is also provided. Applications Ordering Information Point-of-Sale Printers Video Security Cameras ORDER TEMP. PACKAGE Office Automation Machines MARKING NUMBER RANGE (Green) Gaming Machines G2053FC1U G2053 -40C to +85C TSSOP-16 (FD) Robotics G2053R41U 2053 -40C to +85C TQFN3X3-16 Battery-Powered Toys G2053R81U 2053 -40C to +85C TQFN4X4-16 Note: FC: TSSOP-16 (FD) R4: TQFN3X3-16 R8: TQFN4X4-16 1: Bonding Code U : Tape & Reel Green: Lead Free / Halogen Free Pin Configuration G2053 1 16 AIN1 nSLEEP 2 AIN2 AISEN 12 15 1 VINT AOUT1 3 14 AISEN VINT AOUT2 2 11 GND Thermal AOUT2 4 13 GND Pad Thermal 10 3 V BOUT2 M BOUT2 5 Pad 12 V M 4 9 NC BISEN 6 11 NC BISEN BOUT1 7 10 BIN2 9 nFAULT 8 BIN1 TSSOP-16 (FD) G2053 TQFN3X3-16/TQFN4X4-16 Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. Ver: 0.1 Jan 19, 2018 1 BOUT1 5 16 AOUT1 6 15 nFAULT nSLEEP BIN1 7 14 AIN1 13 AIN2 BIN2 8 G2053 Global Mixed-mode Technology Absolute Maximum Ratings Thermal Resistance of Junction to Ambient, ( ) Power supply (V ). . . . . . . . . .. . . . . . . . -0.3V to 11.8V JC M Internal regulator (VINT). . . . . . . . . . . . . .-0.3V to 3.8V TSSOP-16 (FD). . . . . . . . . . . . . .. . . . . . . . . .TBDC/W Control pins (AIN1, AIN2, BIN1, BIN2, nSLEEP, TQFN3X3-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBDC/W nFAULT) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V TQFN4X4-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBDC/W Continuous phase node pins (AOUT1, AOUT2, BOUT1, Operating junction temperature (T ) . . .-40C to 150C J BOUT2). . . . . . . . . . . . . . . -0.3V to V +0.5V Storage Temperature (Tstg) . . . . . . . . -65C to 150C M Pulsed 10s phase node pins (AOUT1, AOUT2, Reflow Temperature (soldering, 10sec) . . . . . . 260C BOUT1, BOUT2). . . . . . . . . . . . . . . . . . . .-1V to V +1V ESD (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2KV M Continuous shunt amplifier input pins (AISEN, ESD (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1KV BISEN). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.5V Pulsed 10s shunt amplifier input pins (AISEN, Recommended Operating Conditions BISEN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to +1V (1) Power supply voltage (V ) . . . . . . . . . . 2.7V to 10.8V M Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2, Logic level input voltage (V ). . . . . . . . . . . . .0V to 5.5V I AISEN, BISEN) . . . . . . . . . . . . . . . . Internally limited A (2) Motor RMS current (I ) RMS Thermal Resistance of Junction to Ambient, ( ) JA TSSOP-16 (FD). . . . . . . . . . . . . . . . . . . . . . .0 to 0.7A TSSOP-16 (FD). . . . . . . . . . . . . .. . . . . . . . . .TBDC/W TQFN3X3-16/TQFN4X4-16. . . . . . . . . . . . .0 to 0.6A TQFN3X3-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBDC/W Applied PWM signal to AIN1, AIN2, BIN1, or BIN2 TQFN4X4-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBDC/W (f ) . . . . . . . . . . . . . . . . . . . . . . . . .0 to 200KHz PWM Continuous Power Dissipation (T = +25C) A Operating ambient temperature (T ) . . .-40C to 85C A TSSOP-16 (FD). . . . . . . . . . . . . . . . . . . . . . . .TBDmW TQFN3X3-16. . . . . . . . . . . . . . . . . . . . . . . . . .TBDmW TQFN4X4-16. . . . . . . . . . . . . . . . . . . . . . . . . .TBDmW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (1) Note that when V is below 5V, R increases and maximum output current is reduced. M DS(ON) (2) Power dissipation and thermal limits must be observed. Electrical Characteristics (T =25C) A The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. PARAMETER SYMBOL CONDITIONS MIN TYP MAXUNIT POWER SUPPLIES (V , VINT) M V operating voltage V 2.7 --- 10.8 V M M V = 5V, xINx low, nSLEEP high V operating supply current I --- 1.7 3 mA M VM M V sleep mode supply current I V = 5V, nSLEEP low --- 1.6 2.7 A M VMQ M Sleep time t nSLEEP low to sleep mode --- 10 --- s SLEEP Wake-up time t nSLEEP high to output transition --- 155 --- s WAKE Turn-on time t V > VUVLO to output transition --- 25 --- s ON M Internal regulator voltage V V > VUVLO to output transition 3 3.3 3.6 V INT M CONTROL INPUTS (AIN1, AIN2, BIN1, BIN2, nSLEEP) xINx 0 --- 0.7 Input logic low voltage V V IL nSLEEP 0 --- 0.5 xINx 2 --- 5.5 Input logic high voltage V V IH nSLEEP 2.5 --- 5.5 Input logic hysteresis V 350 400 650 mV HYS Input logic low current I VIN = 0V -1 --- 1 A IL Input logic high current I VIN = 5V --- --- 50 A IH xINx 100 150 250 Pulldown resistance R k PD nSLEEP 380 500 750 Input deglitch time t --- 575 --- ns DEG Propagation delay INx to OUTx t V = 5V --- 1.2 --- s PROP IN Ver: 0.1 Jan 19, 2018 2