Product Information

62128ELL-45SXI

62128ELL-45SXI electronic component of Infineon

Datasheet
1M MOBL ULTRA LOW POWER HIGH SPEED ASYNC SRAM SOIC-32

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.202 ea
Line Total: USD 3.202

48 - Global Stock
Ships to you by
Mon. 01 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
48 - Global Stock


Ships to you by Mon. 01 Apr

MOQ : 1
Multiples : 1

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62128ELL-45SXI
Infineon

1 : USD 3.202
2 : USD 2.8971
3 : USD 2.2872
4 : USD 1.9822
5 : USD 1.906

     
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CY62128E MoBL 1-Mbit (128 K 8) Static RAM 1-Mbit (128 K 8) Static RAM Features Functional Description Very high speed: 45 ns The CY62128E is a high performance CMOS static RAM organized as 128K words by 8 bits. This device features Temperature ranges advanced circuit design to provide ultra low active current. This Industrial: 40 C to +85 C is ideal for providing More Battery Life (MoBL ) in portable Automotive-A: 40 C to +85 C applications. The device also has an automatic power down Automotive-E: 40 C to +125 C feature that significantly reduces power consumption when addresses are not toggling. Placing the device into standby Voltage range: 4.5 V to 5.5 V mode reduces power consumption by more than 99 percent when deselected (CE HIGH or CE LOW). The eight input and Pin compatible with CY62128B 1 2 output pins (I/O through I/O ) are placed in a high impedance 0 7 Ultra low standby power state when the device is deselected (CE HIGH or CE LOW), 1 2 Typical standby current: 1 A the outputs are disabled (OE HIGH), or a write operation is in Maximum standby current: 4 A (Industrial) progress (CE LOW and CE HIGH and WE LOW). 1 2 To write to the device, take Chip Enable (CE LOW and CE Ultra low active power 1 2 HIGH) and Write Enable (WE) inputs LOW. Data on the eight I/O Typical active current: 1.3 mA at f = 1 MHz pins (I/O through I/O ) is then written into the location specified 0 7 Easy memory expansion with CE , CE and OE features 1 2, on the address pins (A through A ). 0 16 Automatic power down when deselected To read from the device, take Chip Enable (CE LOW and CE 1 2 HIGH) and Output Enable (OE) LOW while forcing Write Enable complementary metal oxide semiconductor (CMOS) for (WE) HIGH. Under these conditions, the contents of the memory optimum speed and power location specified by the address pins appear on the I/O pins. Offered in standard Pb-free 32-pin STSOP, 32-pin SOIC, and The CY62128E device is suitable for interfacing with processors 32-pin thin small outline package (TSOP) Type I packages that have TTL I/P levels. It is not suitable for processors that require CMOS I/P levels. Please see Electrical Characteristics on page 5 for more details and suggested alternatives. Logic Block Diagram I/O INPUT BUFFER I/O0 0 A 0 I/O A I/O1 1 1 A 2 A I/O I/O 3 2 2 A 4 A 128K x 8 I/O I/O 5 3 3 A 6 A ARRAY I/OI/O 7 44 A 8 A I/O I/O 9 55 A 10 A I/O 11 I/O 6 6 CE 1 I/O CE POWER I/O7 2 COLUMN DECODER 7 WE DOWN OE Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 38-05485 Rev. *M Revised August 19, 2014 ROW DECODER A 12 A 13 A 14 A 15 A 16 SENSE AMPS CY62128E MoBL Contents Pin Configuration .............................................................3 Ordering Information ...................................................... 13 Product Portfolio ..............................................................4 Ordering Code Definitions ......................................... 13 Maximum Ratings .............................................................5 Package Diagrams .......................................................... 14 Operating Range ...............................................................5 Acronyms ........................................................................17 Electrical Characteristics .................................................5 Document Conventions ................................................. 17 Capacitance ......................................................................6 Units of Measure ....................................................... 17 Thermal Resistance ..........................................................6 Document History Page ................................................. 18 AC Test Loads and Waveforms .......................................6 Sales, Solutions, and Legal Information ...................... 20 Data Retention Characteristics .......................................7 Worldwide Sales and Design Support ....................... 20 Data Retention Waveform ................................................7 Products ....................................................................20 Switching Characteristics ................................................8 PSoC Solutions ...................................................... 20 Switching Waveforms ......................................................9 Cypress Developer Community ................................. 20 Truth Table ......................................................................12 Technical Support ..................................................... 20 Document Number: 38-05485 Rev. *M Page 2 of 20

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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