CY7C1668KV18 CY7C1670KV18 144-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) 144-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) Features Configurations 144-Mbit density (8 M 18, 4 M 36) With Read Cycle Latency of 2.5 cycles: CY7C1668KV18 8 M 18 550-MHz clock for high bandwidth CY7C1670KV18 4 M 36 Two-word burst for reducing address bus frequency Double data rate (DDR) interfaces (data transferred at Functional Description 1100 MHz) at 550 MHz The CY7C1668KV18, and CY7C1670KV18 are 1.8-V Available in 2.5-clock cycle latency synchronous pipelined SRAMs equipped with DDR II+ architecture. The DDR II+ consists of an SRAM core with Two input clocks (K and K) for precise DDR timing advanced synchronous peripheral circuitry. Addresses for read SRAM uses rising edges only and write are latched on alternate rising edges of the input (K) Echo clocks (CQ and CQ) simplify data capture in high-speed clock. Write data is registered on the rising edges of both K and systems K. Read data is driven on the rising edges of K and K. Each address location is associated with two 18-bit words Data valid pin (QVLD) to indicate valid data on the output (CY7C1668KV18), or 36-bit words (CY7C1670KV18) that burst sequentially into or out of the device. Synchronous internally self-timed writes Asynchronous inputs include an output impedance matching DDR II+ operates with 2.5-cycle read latency when DOFF is input (ZQ). Synchronous data outputs (Q, sharing the same asserted HIGH physical pins as the data inputs D) are tightly matched to the two Operates similar to DDR I device with one cycle read latency output echo clocks CQ/CQ, eliminating the need for separately when DOFF is asserted LOW capturing data from each individual DDR SRAM in the system design. 1 Core V = 1.8 V 0.1 V I/O V = 1.4 V to V DD DDQ DD All synchronous inputs pass through input registers controlled by Supports both 1.5-V and 1.8-V I/O supply the K or K input clocks. All data outputs pass through output High-speed transceiver logic (HSTL) inputs and variable drive registers controlled by the K or K input clocks. Writes are HSTL output buffers conducted with on-chip synchronous self-timed write circuitry. For a complete list of related documentation, click here. Available in 165-ball fine pitch ball grid array (FBGA) package (15 17 1.4 mm) Offered in Pb-free packages JTAG 1149.1 compatible test access port Phase locked loop (PLL) for accurate data placement Selection Guide Description 550 MHz 450 MHz Unit Maximum operating frequency 550 450 MHz Maximum operating current 18 910 790 mA 36 1140 980 Note 1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V = 1.4 V to V . DDQ DD Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-44062 Rev. *K Revised December 1, 20174M x 18 Array 2M x 36 Array 4M x 18 Array 2M x 36 Array CY7C1668KV18 CY7C1670KV18 Logic Block Diagram CY7C1668KV18 Write Write 22 A Reg Reg (21:0) Address Register 18 LD K Output CLK R/W K Logic Gen. Control DOFF Read Data Reg. 36 CQ V 18 REF 18 Reg. Reg. CQ Control R/W Logic 18 18 BWS 1:0 Reg. 18 DQ 17:0 QVLD Logic Block Diagram CY7C1670KV18 Write Write 21 A Reg Reg (20:0) Address Register 36 LD K Output CLK R/W K Logic Gen. Control DOFF Read Data Reg. 72 CQ V 36 REF 36 Reg. Reg. CQ Control R/W Logic 36 36 BWS 3:0 Reg. 36 DQ 35:0 QVLD Document Number: 001-44062 Rev. *K Page 2 of 30 Write Add. Decode Write Add. Decode Read Add. Decode Read Add. Decode