Application Note AN 2014-12 V1.1, December 2014 AN2014-12 Application and Mounting Instructions for IHM and IHV Modules2010-03 Application Note AN Application Note AN 2014-12 2009 V1.0, November V1.1, December 2014 Application and Mounting Instructions for IHM and IHV Modules Edition 2014-12 Published by Infineon Technologies AG 59568 Warstein, Germany Infineon Technologies AG 2014. All Rights Reserved. Attention please THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life- support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Revision History: 2012-10-01, V1.0 2014-12-01, V1.1 Previous Version: AN2012-10 Page: Subjects (major changes since last revision) Page 14: material thickness of stencil: 120m for AlSiC, 100m for Cu Author: Thomas Schtze - IFAG IPC HP We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: IGBT.Application infineon.com 2