IRGR3B60KD2PBF Infineon

IRGR3B60KD2PBF electronic component of Infineon
IRGR3B60KD2PBF Infineon
IRGR3B60KD2PBF IGBTs
IRGR3B60KD2PBF  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of IRGR3B60KD2PBF IGBTs across the USA, India, Europe, Australia, and various other global locations. IRGR3B60KD2PBF IGBTs are a product manufactured by Infineon. We provide cost-effective solutions for IGBTs, ensuring timely deliveries around the world.

Part No. IRGR3B60KD2PBF
Manufacturer: Infineon
Category: IGBTs
Description: IGBT Transistors 600V Non Punch Thru Short Cir Ratd IGBT
Datasheet: IRGR3B60KD2PBF Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 75
Multiples : 75
QtyUnit Price
75$ 0.7272
900$ 0.65
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.3658
10$ 1.2082
100$ 0.9569
500$ 0.8575
1000$ 0.8171
3000$ 0.8171
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.3527
3$ 0.743
41$ 0.6999
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Technology
Mounting Style
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Maximum Gate Emitter Voltage
Continuous Collector Current at 25 C
Pd - Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Package / Case
Brand
Power Dissipation
Factory Pack Quantity :
Height
Length
Width
Gate-Emitter Leakage Current
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Tradename
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the IRGR3B60KD2PBF from our IGBTs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRGR3B60KD2PBF and other electronic components in the IGBTs category and beyond.

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PD - 95036 IRGR3B60KD2PbF INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE C Features V = 600V CES Low VCE (on) Non Punch Through IGBT Technology. Low Diode VF. 10s Short Circuit Capability. I = 4.2A, T =100C C C Square RBSOA. Ultrasoft Diode Reverse Recovery Characteristics. G Positive VCE (on) Temperature Coefficient. t > 10s, T =150C sc J Lead-Free E V typ. = 1.9V CE(on) n-channel Benefits Benchmark Efficiency for Motor Control. Rugged Transient Performance. Low EMI. Excellent Current Sharing in Parallel Operation. D-Pak Absolute Maximum Ratings Parameter Max. Units V Collector-to-Emitter Voltage 600 V CES I T = 25C Continuous Collector Current 7.8 A C C T = 100C Continuous Collector Current 4.2 I C C Pulse Collector Current (Ref.Fig.C.T.5) 15.6 I CM Clamped Inductive Load current I 15.6 LM I Tc = 25C Diode Continous Forward Current 6.0 F I Tc = 100C Diode Continuous Forward Current 3.2 F I Diode Maximum Forward Current 15.6 FM Gate-to-Emitter Voltage 20 V V GE P T = 25C Maximum Power Dissipation 52 W D C P T = 100C Maximum Power Dissipation 21 D C Operating Junction and -55 to +150 T J T Storage Temperature Range C STG Soldering Temperature Range, for 10 sec. 300 (0.063 in. (1.6mm) from case) Thermal / Mechanical Characteristics Parameter Min. Typ. Max. Units R Junction-to-Case- IGBT 2.4 C/W JC R Junction-to-Case- Diode 8.8 JC Junction-to-Ambient, (PCB Mount) R 50 JA WtWeight 0.3g www.irf.com 1 2/23/04IRGR3B60KD2PbF Electrical Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions Ref.Fig. V Collector-to-Emitter Breakdown Voltage 600 V V = 0V, I = 500A (BR)CES GE C V /T Temperature Coeff. of Breakdown Voltage 0.32 V/C V = 0V, I = 1mA (25C-150C) (BR)CES J GE C V I = 3.0A, V = 15V 5,6,7 Collector-to-Emitter Voltage 1.9 2.4 CE(on) C GE I = 3.0A, V = 15V, T = 150C 2.2 2.6 V 9,10,11 C GE J V V = V , I = 250A Gate Threshold Voltage 3.5 4.5 5.5 9,10,11 GE(th) CE GE C V / T Threshold Voltage temp. coefficient -8.5 mV/C V = V , I = 1mA (25C-150C) 12 GE(th) J CE GE C gfe Forward Transconductance 1.9 S V = 50V, I = 3.0A, PW = 80s CE C I Zero Gate Voltage Collector Current 1.0 150 A V = 0V, V = 600V CES GE CE 200 500 V = 0V, V = 600V, T = 150C GE CE J V Diode Forward Voltage Drop 1.5 1.8 V I = 3.0A, V = 0V 8 FM F GE I = 3.0A, V = 0V, T = 150C 1.5 1.8 F GE J I V = 20V, V = 0V GES Gate-to-Emitter Leakage Current 100 nA GE CE Switching Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions Ref.Fig. Q Total Gate Charge (turn-on) 13 20 I = 3.0A 23 g C Q Gate-to-Emitter Charge (turn-on) 1.5 2.3 nC V = 400V CT1 ge CC Q V = 15V Gate-to-Collector Charge (turn-on) 6.6 9.9 gc GE E I = 3.0A, V = 400V Turn-On Switching Loss 62 75 CT4 on C CC E V = 15V, R = 100, L = 2.5mH Turn-Off Switching Loss 39 50 J off GE G E Total Switching Loss 100 120 T = 25C tot J t Turn-On delay time 18 22 I = 3.0A, V = 400V d(on) C CC t Rise time 15 21 ns V = 15V, R = 100, L = 2.5mH CT4 r GE G t Turn-Off delay time 110 120 T = 25C d(off) J t Fall time 68 80 f E I = 3.0A, V = 400V CT4 on Turn-On Switching Loss 91 100 C CC E V = 15V, R = 100, L = 2.5mH off Turn-Off Switching Loss 98 140 J GE G 13,15 E T = 150C Total Switching Loss 190 230 WF1,WF2 tot J t Turn-On delay time 18 22 I = 3.0A, V = 400V 14,16 d(on) C CC t Rise time 17 22 ns V = 15V, R = 100, L = 2.5mH CT4 r GE G t Turn-Off delay time 120 140 T = 150C WF1 d(off) J t Fall time 91 105 WF2 f C Input Capacitance 190 V = 0V ies GE C Output Capacitance 23 pF V = 30V 22 oes CC C Reverse Transfer Capacitance 6.6 f = 1.0MHz res T = 150C, I = 15.6A, Vp = 600V 4 RBSOA Reverse Bias Safe Operating Area FULL SQUARE J C V =500V,V =+15V to 0V,R = 100 CT2 CC GE G T = 150C, Vp = 600V, R = 100 SCSOA Short Circuit Safe Operating Area 10 s CT3 J G V =360V,V = +15V to 0V WF4 CC GE Erec Reverse Recovery Energy of the Diode 38 44 J T = 150C 17,18,19 J t Diode Reverse Recovery Time 77 84 ns V = 400V, I = 3.0A, L = 2.5mH 20,21 rr CC F I Diode Peak Reverse Recovery Current 4.8 5.3 A V = 15V, R = 100 CT4,WF3 rr GE G Energy losses includetai and diode reverse recovery. V = 80% (V ), V = 15V, L = 100H, R = 100. CC CES GE G When mounted on 1 square PCB (FR-4 or G-10 Material ) . For recommended footprint and soldering techniques refer to application note AN-994. 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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