TT175N16SOFHPSA1 Infineon

TT175N16SOFHPSA1 electronic component of Infineon
TT175N16SOFHPSA1 Infineon
TT175N16SOFHPSA1 SCR Modules
TT175N16SOFHPSA1  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of TT175N16SOFHPSA1 SCR Modules across the USA, India, Europe, Australia, and various other global locations. TT175N16SOFHPSA1 SCR Modules are a product manufactured by Infineon. We provide cost-effective solutions for SCR Modules, ensuring timely deliveries around the world.

Part No. TT175N16SOFHPSA1
Manufacturer: Infineon
Category: SCR Modules
Description: THYRISTOR MODULE, 1.6KV, 175A, MODULE
Datasheet: TT175N16SOFHPSA1 Datasheet (PDF)
Price (USD)
1: USD 40.7102 ea
Line Total: USD 40.71 
Availability : 0
  
QtyUnit Price
1$ 40.7102

Availability 0
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 10
Multiples : 1
QtyUnit Price
10$ 66.9967


Availability 0
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 87.9808
5$ 78.9176
10$ 70.3009
50$ 69.0027


Availability 0
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 73.7302
5$ 70.4877
10$ 61.9478


Availability 0
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 40.7102


Availability 0
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 97.9387
5$ 92.4788
10$ 83.4356

   
Manufacturer
Product Category
Brand
Scr Module Type
Peak Repetitive Off-State Voltage Vdrm
Gate Trigger Current Max Igt
Current It Av
On State Rms Current Itrms
Peak Non Rep Surge Current Itsm 50Hz
Holding Current Max Ih
Gate Trigger Voltage Max Vgt
Operating Temperature Max
Svhc
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the TT175N16SOFHPSA1 from our SCR Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TT175N16SOFHPSA1 and other electronic components in the SCR Modules category and beyond.

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AN2016-06 34mm and 50mm Solder Bond Modules Use and Installation Manual Application Note Please read the Important Notice and Warnings at the end of this document Revison 1.0 www.infineon.com> 2016-09-29 34mm and 50mm Solder Bond Modules Use and Installation Manual Introduction Contents 1 Introduction .......................................................................................................................... 3 2 Delivery quality ..................................................................................................................... 4 3 Storage and shipping of 34 mm and 50mm solder bond modules ................................... 5 4 Module identification, RoHS ................................................................................................ 6 5 Module selection .................................................................................................................. 7 6 Selecting module voltage class and operation of modules at high altitudes .................. 9 7 Climatic conditions in active, current conducting operation of 34mm and 50mm solder bond modules ......................................................................................................... 10 8 Module creepage and clearance distances ...................................................................... 11 9 Module assembly and mounting to a heatsink................................................................. 13 9.1 Heatsink properties for module assembly ............................................................................. 13 9.2 Thermal grease .................................................................................................................... 13 9.3 Thermal Interface Material (TIM) from Infineon ..................................................................... 14 9.4 Application of standard thermal grease and the stencil printing process ............................... 15 9.5 Alternative procedures for the application of standard thermal grease.................................. 17 9.6 Mounting the module to the heatsink .................................................................................... 17 9.7 Connection and installation of the load current busbar ......................................................... 22 9.8 Example 1: Connecting the gate and auxiliary cathode of 34mm and 50mm solder bond modules ....................................................................................................................... 25 9.9 Example 2: Connecting the gate and auxiliary cathode of the 34mm and 50mm solder bond modules ....................................................................................................................... 26 10 Use under vibration and shock conditions ...................................................................... 27 11 References .......................................................................................................................... 28 Application Note AN2016-06 2 Revision 1.0 2016-09-29

Tariff Desc

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