X-On Electronics has gained recognition as a prominent supplier of EP3SL200F1517C2N fpga - field programmable gate array across the USA, India, Europe, Australia, and various other global locations. EP3SL200F1517C2N fpga - field programmable gate array are a product manufactured by Intel. We provide cost-effective solutions for fpga - field programmable gate array, ensuring timely deliveries around the world.

EP3SL200F1517C2N Intel

EP3SL200F1517C2N electronic component of Intel
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Part No.EP3SL200F1517C2N
Manufacturer: Intel
Category:FPGA - Field Programmable Gate Array
Description: FPGA Stratix® III L Family 200000 Cells 600MHz 65nm Technology 1.1V 1517-Pin FC-FBGA
Datasheet: EP3SL200F1517C2N Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
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Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 21
Multiples : 21
21 : USD 12774.4724
N/A

Obsolete
0 - WHS 2

MOQ : 2
Multiples : 2
2 : USD 12665.8856
N/A

Obsolete
     
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Embedded Block Ram - Ebr
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1. Stratix III Device Family Overview SIII51001-2020.06.15 The Stratix III family provides one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace. Stratix III FPGAs lower power consumption through Alteras innovative Programmable Power Technology, which provides the ability to turn on the performance where needed and turn down the power consumption for blocks not in use. Selectable Core Voltage and the latest in silicon process optimizations are also employed to deliver the industrys lowest power, high-performance FPGAs. Specifically designed for ease of use and rapid system integration, the Stratix III FPGA family offers two variants optimized to meet different application needs: The Stratix III L family provides balanced logic, memory, and multiplier ratios for mainstream applications. The Stratix III E family is memory- and multiplier-rich for data-centric applications. Modular I/O banks with a common bank structure for vertical migration lend efficiency and flexibility to the high-speed I/O. Package and die enhancements with dynamic on-chip termination, output delay, and current strength control provide best-in-class signal integrity. Based on a 1.1-V, 65-nm all-layer copper SRAM process, the Stratix III family is a programmable alternative to custom ASICs and programmable processors for high-performance logic, digital signal processing (DSP), and embedded designs. Stratix III devices include optional configuration bit stream security through volatile or non-volatile 256-bit Advanced Encryption Standard (AES) encryption. Where ultra-high reliability is required, Stratix III devices include automatic error detection circuitry to detect data corruption by soft errors in the configuration random-access memory (CRAM) and user memory cells. Features Summary Stratix III devices offer the following features: 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 11) 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers High-speed DSP blocks provide dedicated implementation of 99, 1212, 1818, and 3636 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity Programmable Power Technology, which minimizes power while maximizing device performance Stratix III Device Handbook, Volume 112 Chapter 1: Stratix III Device Family Overview Features Summary Selectable Core Voltage, available in low-voltage devices (L ordering code suffix), enables selection of lowest power or highest performance operation Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting Memory interface support with dedicated DQS logic on all I/O banks Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks Up to 1,104 user I/O pins arranged in 24 modular I/O banks that support a wide range of industry I/O standards Dynamic On-Chip Termination (OCT) with auto calibration support on all I/O banks High-speed differential I/O support with serializer/deserializer (SERDES) and dynamic phase alignment (DPA) circuitry for 1.6 Gbps performance Support for high-speed networking and communications bus standards including SPI-4.2, SFI-4, SGMII, Utopia IV, 10 Gigabit Ethernet XSBI, Rapid I/O, and NPSI The only high-density, high-performance FPGA with support for 256-bit AES volatile and non-volatile security key to protect designs Robust on-chip hot socketing and power sequencing support Integrated cyclical redundancy check (CRC) for configuration memory error detection with critical error determination for high availability systems support Built-in error correction coding (ECC) circuitry to detect and correct data errors in M144K TriMatrix memory blocks Nios II embedded processor support Support for multiple intellectual property megafunctions from Altera MegaCore SM functions and Altera Megafunction Partners Program (AMPP ) Stratix III Device Handbook, Volume 1

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ALTERA
Altera (part of the Intel Group)
Altera (VA)
Altera Corporation
INTEL (ALTERA)
Intel (CPU)
Intel (formerly Altera)
Intel / Altera
INTEL / LEVEL ONE

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