3.5x3.5 mm SMD CHIP LED LAMP
Part Number: AA3535SYL1Z1S Super Bright Yellow
PRELIMINARY SPEC
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Description
The source color devices are made with AlGaInP Light
Features
Emitting Diode.
z White SMD package, silicone resin.
Static electricity and surge damage the LEDS.
z Low thermal resistance.
It is recommended to use a wrist band or anti-electrostatic
z Compatible with IR-reflow processes.
glove when handling the LEDs.
z ESD protection.
All devices, equipment and machinery must be electrically
z Package: 2000pcs / reel.
grounded.
z Moisture sensitivity level : level 2a.
z RoHS compliant.
Applications
z Signal and symbol luminaire for orientation.
z Marker lights (e.g. steps, exit ways, etc).
z Decorative and entertainment lighting.
z Commercial and residential lighting.
z Automotive interior lighting.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAJ4025 REV NO: V.1 DATE: MAY/20/2009 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201004888 Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might leads to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAJ4025 REV NO: V.1 DATE: MAY/20/2009 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201004888