Product Information

HX316C10FBK2/16

HX316C10FBK2/16 electronic component of Kingston

Datasheet
DRAM Module DDR3 SDRAM 16Gbyte 240DIMM
Manufacturer: Kingston
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 189.0194 ea
Line Total: USD 189.02

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

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0 - WHS 1


Ships to you between Fri. 10 May to Thu. 16 May

MOQ : 1
Multiples : 1
1 : USD 189.0194

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Additional Infomation About Product

HX316C10FBK2/16 16GB (8GB 1G x 64-Bit x 2 pcs.) DDR3-1600 CL10 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 10 cycles Row Cycle Time (tRCmin) 48.125ns (min.) Refresh to Active/Refresh 260ns (min.) Command Time (tRFCmin) Row Active Time (tRASmin) 37.5ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V - 0 o o Operating Temperature 0 C to 85 C o o Storage Temperature -55 C to +100 C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX316C10FBK2/16 is a kit of two 1G x 64-bit (8GB) JEDEC standard 1.5V (1.425V ~1.575V) Power Supply DDR3-1600 CL10 SDRAM (Synchronous DRAM) 2Rx8 memory VDDQ = 1.5V (1.425V ~ 1.575V) modules, based on sixteen 512M x 8-bit DDR3 FBGA compo- nents per module. Total kit capacity is 16GB. Each module kit 800MHz fCK for 1600Mb/sec/pin has been tested to run at DDR3-1600 at a low latency timing of 8 independent internal bank 10-10-10 at 1.5V. Additional timing parameters are shown in Programmable CAS Latency: 11, 10, 9, 8, 7, 6 the PnP Timing Parameters section below. The JEDEC stan- dard electrical and mechanical specifications are as follows: Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will Burst Length: 8 (Interleave without any limit, sequential with be determined by your BIOS. starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write either on the fly using A12 or MRS PnP JEDEC TIMING PARAMETERS: Bi-directional Differential Data Strobe DDR3-1600 CL10-10-10 1.5V Internal(self) calibration : Internal self calibration through ZQ DDR3-1333 CL9-9-9 1.5V pin (RZQ : 240 ohm 1%) DDR3-1066 CL7-7-7 1.5V On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C Asynchronous Reset Height 1.291 (32.80mm) w/heatsink, double sided component Continued >> kingston.com/hyperx Document No. 4807008-001.B00 04/23/15 Page 1continued HyperX MODULE WITH HEAT SPREADER 7.08 mm 133.35 mm MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. kingston.com/hyperx Document No. 4807008-001.B00 Page 2 32.8 mm

HS Compliance

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:

Kingston may also be referenced as

KINGSTON CARTON COMPANY LTD
Kingston Technology
KINGSTON TECHNOLOGY COMPANY
KNG

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