Product Information

KVR13R9S4L/8

KVR13R9S4L/8 electronic component of Kingston

Datasheet
DRAM Module DDR3L SDRAM 8Gbyte 240RDIMM

Manufacturer: Kingston
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 108.3519 ea
Line Total: USD 108.35

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1

Stock Image

KVR13R9S4L/8
Kingston

1 : USD 108.3519

     
Manufacturer
Product Category
Mounting
Operating Temp Range
Package Type
Pin Count
Operating Temperature Max
Operating Temperature Min
Number Of Elements
Device Core Size
Operating Temperature Classification
Maximum Clock Rate
Total Density
Module Type
Main Category
Rad Hardened
Organization
Operating Supply Voltage Typ
Operating Supply Voltage Min
Operating Supply Voltage Max
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
D2516EC4BXGGBI-U electronic component of Kingston D2516EC4BXGGBI-U

4Gb (256 M x 16) 1.35 V 1600 Mbps I-Temp DDR3/3L DRAM - FBGA-96
Stock : 0

D2516EC4BXGGB-U electronic component of Kingston D2516EC4BXGGB-U

4Gb (256 M x 16) 1.35 V 1600 Mbps I-Temp DDR3/3L DRAM - FBGA-96
Stock : 0

KVR21R15D4/16 electronic component of Kingston KVR21R15D4/16

DRAM Module DDR4 SDRAM 16Gbyte 288RDIMM
Stock : 0

SM2280S3G2/120G electronic component of Kingston SM2280S3G2/120G

SSDNow M.2 SATA G2 Drive
Stock : 0

SKC400S37/512G electronic component of Kingston SKC400S37/512G

Solid-State Drive
Stock : 0

EMMC04G-W627-M06U electronic component of Kingston EMMC04G-W627-M06U

eMMC 4GB I-temp eMMC 5.1 (HS400) 153B
Stock : 0

Image Description
IS42S16320F-7BL electronic component of ISSI IS42S16320F-7BL

DRAM 512M, 3.3V, SDRAM, 32Mx16, 143MHz, 54 ball BGA (8mmx13mm), RoHS
Stock : 235

AS4C32M16D1-5TCN electronic component of Alliance Memory AS4C32M16D1-5TCN

Alliance Memory DRAM 512Mb, 3.3V, 200Mhz 32M x 16 DDR
Stock : 1

IS43TR16640BL-125JBL electronic component of ISSI IS43TR16640BL-125JBL

DRAM 1G, 1.35V, DDR3L, 64Mx16, 1600MT/s @ 10-10-10, 96 ball BGA (9mm x13mm) RoHS
Stock : 75

Hot IS43DR16320E-25DBLI electronic component of ISSI IS43DR16320E-25DBLI

DRAM 512M 32Mx16 400MHz DDR2 1.8V
Stock : 1901

MT48LC4M32B2P-6A:L TR electronic component of Micron MT48LC4M32B2P-6A:L TR

DRAM SDRAM 128M 4MX32 TSOP
Stock : 0

IS42S32800J-75EBL electronic component of ISSI IS42S32800J-75EBL

DRAM 256M, 3.3V, SDRAM, 8Mx32, 133Mhz @ CL2, 90 ball BGA (8mmx13mm) RoHS
Stock : 0

IS43DR86400E-3DBLI electronic component of ISSI IS43DR86400E-3DBLI

DRAM 512M, 1.8V, DDR2, 64Mx8, 333Mhz @ CL5, 60 ball BGA (8mmx10.5mm) RoHS, IT
Stock : 242

AS4C128M8D3LB-12BIN electronic component of Alliance Memory AS4C128M8D3LB-12BIN

DRAM 1G 1.35V 800MHz 128Mx8 DDR3 I-Temp
Stock : 1

IS43R16320F-6TLI electronic component of ISSI IS43R16320F-6TLI

DRAM 512M 32Mx16 166MHz DDR 2.5V
Stock : 0

W631GG6NB-12 electronic component of Winbond W631GG6NB-12

DRAM 1Gb DDR3 SDRAM, x16, 800MHz
Stock : 1

Memory Module Speci cations KVR13R9S4L/8 8GB 1Rx4 1G x 72-Bit PC3-10600 CL9 Registered w/Parity 240-Pin DIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM s 1G x 72-bit (8GB) CL(IDD) 9 cycles DDR3L-1333 CL9 SDRAM (Synchronous DRAM), registered w/ Row Cycle Time (tRCmin) 49.5ns (min.) parity, 1Rx4 ECC VLP memory module, based on eighteen 1G Refresh to Active/Refresh 260ns (min.) x 4-bit FBGA components. The SPD is programmed to JEDEC Command Time (tRFCmin) standard latency DDR3-1333 timing of 9-9-9 at 1.5V. This 240- Row Active Time (tRASmin) 36ns (min.) pin DIMM uses gold contact fingers. The electrical and me- Maximum Operating Power 5.601 W* chanical specifications are as follows: UL Rating 94 V - 0 o o Operating Temperature 0 C to 85 C o o Storage Temperature -55 C to +100 C FEATURES JEDEC standard 1.5V (1.425V ~1.575V) Power Supply *Power will vary depending on the SDRAM and Register/PLL used. VDDQ = 1.5V (1.425V ~ 1.575V) 667MHz fCK for 1333Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9, 8, 7, 6 Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7 (DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write either on the fly using A12 or MRS Bi-directional Differential Data Strobe Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) On Die Termination using ODT pin On-DIMM thermal sensor (Grade B) Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C Asynchronous Reset PCB : Height 0.740 (18.75mm), double sided component Continued >> Document No. VALUERAM1257-001.A00 09/24/12 Page 1MODULE DIMENSIONS: Document No. VALUERAM1257-001.A00 Page 2

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
KINGSTON CARTON COMPANY LTD
Kingston Technology
KINGSTON TECHNOLOGY COMPANY
KNG

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted