The MTC-150-16 is a high-performance copper laminate manufactured by Kubara Lamina Corporation. It is designed for use in advanced electronic packaging, such as for microcircuits, RF modules, and other high-performance applications. It features a low coefficient of thermal expansion, superior thermal conductivity, and high-reliability performance. The MTC-150-16 is made of 16 discrete copper layers with a total thickness of 150µm and a dielectric constant of 4.2. The laminate is compatible with lead-free soldering technologies, and standing wave ratios of less than 1.05 for 50 ohm lines are achievable. The copper conductive layers have a copper finish of between 0.25-0.5µm over a thickness of 35µm.