A10464-02

TM Tgon 800 Series Electrically and Thermally Innovative Technology Conductive Interface Pad for a Connected World HigH-PERFORMANCE, COST EFFECTivE THERMAl iNTERFACE MATERiAl Used where electrical isolation is not required, Tgon 800 is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied in 12 x 18 (305mm x 457mm) or 18 x 24 (457mm x 610mm) sheets, rolls or die-cut to specific configurations. It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance. FEATURES High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis >98% graphite Low thermal resistance Thicknesses of 0.005, 0.010 and 0.020 (0.125mm, 0.25mm, and 0.50mm) APPliCATiONS Power conversion equipment Power supplies Large telecommunications switching hardware Notebook computers Where electrical grounding is required with good thermal conductivity global solutions: local support TM Americas: +1.888.246.9050 Europe: +49.0.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice lairdtech.com www.lairdtech.com/thermalTM Tgon 800 Series Electrically and Thermally Innovative Technology Conductive Interface Pad for a Connected World TM TgON 800 TYPiCAl PROPERTiES TgoN 805 TgoN 810 TgoN 820 TesT MeTHod Construction & Composition Flexible Graphite Flexible Graphite Flexible Graphite Color Pewter Pewter Pewter Visual Thickness 0.005 (0.13mm) 0.010 (0.25mm) 0.020 (0.51mm) Thickness Tolerance 0.001 0.001 0.002 ( 0.025mm) ( 0.025mm) ( 0.05mm) Density 2.20 g/cc 2.20 g/cc 2.20 g/cc Helium Pycnometer Hardness 85 Shore A 85 Shore A 85 Shore A ASTM D2240 Tensile strength 650 psi 650 psi 650 psi ASTM D412 Outgassing TML 0.15% 0.15% 0.15% ASTM E595 Outgassing CVCM 0.09% 0.09% 0.09% ASTM E595 UL Flammability rating 94 VO 94 VO 94 VO Temperature range -240C to 300C -240C to 300C -240C to 300C Thermal conductivity - Z Axis 5 W/mK 5 W/mK 5 W/mK ASTM D5470 (modified) Thermal conductivity - XY Axis 240 W/mK 240 W/mK 240 W/mK ASTM D5470 (modified) 2 2 2 Thermal resistance 100 psi 0.07 C-in /W 0.10 C-in /W 0.17 C-in /W ASTM D5470 (modified) 2 2 2 Thermal resistance 681 KPa 0.42 C-cm /W 0.66 C-cm /W 1.07 C-cm /W ASTM D5470 (modified) -5 -5 -5 Volume resistivity (In-Plane) 11 x 10 ohm-cm 11 x 10 ohm-cm 11 x 10 ohm-cm ASTM D257 STANDARD THiCKNESSES 0.005 (0.13mm), 0.010 (0.25mm), 0.020 (0.51mm) Consult the factory for alternate thicknesses. STANDARD SHEET SizE 18 x 24 (457mm x 609.6mm) Tgon 800 sheets are supplied with no liners when ordered without adhesive. With adhesive, they are supplied with no top liner and white release liner on the bottom. Tgon 800 is available on rolls and individual die cut shapes. PRESSURE SENSiTivE ADHESivE Request no adhesive with AO suffix. Request adhesive on one side with A1 suffix. Striped adhesive option on one side designated with SA. Double-sided adhesive is not available. THR-DS-Tgon-800 1109 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A13515-00 Rev I 11/2009