MADP-017025-1314 MADP-030025-1314 SURMOUNT 25M PIN Diodes Rev. V5 RoHS Compliant Case Style ODS 1314 Features 0603 Outline Surface Mount 25m I-Region Length Devices No Wirebonds Required Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling Description This device is a silicon, glass PIN diode surmount chip TM fabricated with M/A-COMs patented HMIC process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. Applications These packageless devices are suitable for usage in moderate incident power, 50dBm/C.W. or where the peak Chip Dimensions power is 75dBm, pulse width is 1 S, and duty cycle is 0.01%. Their low parasitic inductance, 0.4 nH, and DIM INCHES MM excellent RC constant, make these devices a superior choice for higher frequency switch elements when Min Max Min Max compared to their plastic package counterparts. A 0.060 0.062 1.525 1.575 1 B 0.031 0.032 0.775 0.825 Absolute Maximum Ratings TA = +25C (unless otherwise specified) C 0.004 0.008 0.102 0.203 Parameter Absolute Maximum D 0.019 0.021 0.475 0.525 Forward Current 500 mA E 0.019 0.021 0.475 0.525 Reverse Voltage - 135 V F 0.019 0.021 0.475 0.525 Operating Temperature -55C to +125C G 0.029 0.031 0.725 0.775 Storage Temperature -55 C to +150C Junction Temperature +175C Notes: 50dBm C.W. Incident Power 1) Backside metal: 0.1microns thick. Mounting Temperature +280C for 30 seconds 2) Yellow area with hatch lines indicate backside ohmic gold contacts. 3) Both devices have same outline dimensions ( A to G). 1) Exceeding these limits may cause permanent damage 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MADP-017025-1314 MADP-030025-1314 SURMOUNT 25M PIN Diodes Rev. V5 RoHS Compliant Electrical Specifications T = 25C (unless otherwise noted) A Parameter Symbol Conditions Units Min Typ Max Min Typ Max MADP-017025 MADP-030025 1 1 Capacitance C - 40V, 1MHz pF 0.23 0.29 0.50 0.56 T 1 1,3 Capacitance C - 40V, 1GHz pF 0.23 0.50 T 1 1,3 Capacitance , 85C C - 40V, 1GHz pF 0.22 - T 2 2,3 Resistance R +10mA, 1GHz 1.01 0.65 S 2 2,3 Resistance R +70mA, 1GHz 0.64 0.45 S 2 2,3 Resistance , 85C R +10mA, 1GHz 1.48 - S 2 2,3 Resistance , 85C R +70mA, 1GHz 1.03 - S Forward Voltage V +10mA V 0.74 0.90 0.73 0.90 F Reverse Leakage I -135V A - 10 - 10 R Current F1 = 1800MHz Third Order F2 = 1810MHz IP3 dBm 76 77 Intercept Point Input Power = +39dBm CW I bias = +70mA C.W. R I = 0.5A, I = 10mA C/W 30 13 qJL H L Thermal Resistance +10mA / -6mA Lifetime T uS 2.3 2.8 L ( 50 % - 90 % V ) Notes: 1) Total capacitance, C , is equivalent to the sum of Junction Capacitance ,C , and Parasitic Capacitance, C . T j par 2) Series resistance R is equivalent to the total diode resistance : R = R ( Junction Resistance) + R ( Ohmic Resistance) S s j c 3) R and C are measured on an HP4291A Impedance Analyzer with die mounted in an ODS213 package with 80/20, T s Au/Sn solder. MADP-0XX025 Series Typical Spice Parameters +25C Spice Parameter N RS IS IK BV IBV Ct CJO VJ M FC Cpar Cj Units - A (mA) (Volts) (A) (pF) (pF) (Volts) - - (F) MADP-017025-1314 1.1 1.4 5.1E-15 12.6 175 10 0.38 0.10 0.17 0.50 0.12 2.7E-13 MADP-030025-1314 1.1 1.3 7.8E-15 12.7 175 10 0.80 0.27 0.12 0.50 0.07 5.3E-13 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: