Product Information

MASW-011107-DIE

MASW-011107-DIE electronic component of MACOM

Datasheet
RF Switch ICs Switch,SP2T,Die

Manufacturer: MACOM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

50: USD 135.4618 ea
Line Total: USD 6773.09

0 - Global Stock
MOQ: 50  Multiples: 50
Pack Size: 50
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 50
Multiples : 50
50 : USD 140.744

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Number of Switches
Switch Configuration
Insertion Loss
Off Isolation - Typ
Maximum Operating Temperature
Mounting Style
Package / Case
Operating Frequency
Minimum Operating Temperature
Technology
Brand
Off Time - Max
On Time - Max
Hts Code
Product Type
Factory Pack Quantity :
Subcategory
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MASW-011107-DIE GaAs SPDT Non-Reflective Switch Rev. V2 DC - 26.5 GHz Features Functional Schematic Broadband Performance Low Insertion Loss: 1.3 dB 20 GHz High Isolation: 46 dB 20 GHz Fast Switching Speed Non-Reflective Configuration Ultra Low DC Power Consumption Size: 1.3 0.85 0.1 mm RoHS* Compliant Description The MASW-011107-DIE is a versatile, broadband, non-reflective SPDT switch offered as bare die part. The switch operates from DC to 26.5 GHz and provides <2.0 dB insertion loss and >40 dB isolation. The combination of broadband performance along with very fast switching and excellent settling time make this device ideal for many applications, 2 Bondpad Configuration including Test & Measurement, EW and broadband communication systems. Pad Name Function The MASW-011107-DIE is fabricated using GND Ground MACOMs mature 0.5 m low gate-lag pHEMT process. This robust process features full surface RF1 RF 1 passivation for a high performance and high reliability. V1 Control Voltage 1 V2 Control Voltage 2 Ordering Information RFC RF Common Part Number Package RF2 RF 2 1 2. Backside of die must be connected to RF, DC and thermal MASW-011107-DIE Die in Gel Pak ground. 1. Die quantity varies. * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MASW-011107-DIE GaAs SPDT Non-Reflective Switch Rev. V2 DC - 26.5 GHz Electrical Specifications: T = +25C, V1, V2 = -5 V / 0 V, Z = 50 A 0 Parameter Test Conditions Units Min. Typ. Max. 0.05 GHz 0.7 12 GHz 1.0 Insertion Loss 18 GHz dB 1.1 20 GHz 1.3 2.0 25 GHz 1.5 0.05 GHz 53 12 GHz 44 Isolation 18 GHz dB 43 20 GHz 40 46 25 GHz 41 RFC 15 Return Loss RF1, RF2 on state dB 17 RF1, RF2 off state 12 Input P1dB 0.5 - 25 GHz dBm 27 2 Tone, 5 dBm/Tone, 5 MHz spacing, Input IP3 dBm 45 0.5 - 25 GHz T , T 10% to 90% RF and 90% to 10% RF ns 10 RISE FALL 50% control to 90% RF and T , T ns 20 ON OFF 50% control to 10% RF Control Current (Complementary Logic) A 1 3,4 5,6 Absolute Maximum Ratings Truth Table Parameter Absolute Maximum Control Input Condition of Switch V1 V2 RF1 RF2 Control Voltage -8.5 V Low High On Off Input Power 27 dBm High Low Off On Operating Temperature -40C to +85C 5. Vlow = -5 V, Vhigh = 0 V. Storage Temperature -65C to +150C 6. All V1 bondpads and V2 bondpads are connected on die re- spectively. Bias voltages can be supplied to any combination of 3. Exceeding any one or combination of these limits may cause V1 and V2 bondpads. permanent damage to this device. 4. MACOM does not recommend sustained operation near these survivability limits. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity These electronic devices are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit:

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Aeroflex / Metelics (MACOM)
Aeroflex Metelics
M/A-COM
M/A-COM / TYCO
M/A-COM Technology Solutions
MA/COM
MACOM
Nitronex

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