MMP7065-11

High Power Switching and Attenuation Silicon PIN Diodes MMP706x Series Rev. V2 Features CS11 Fast Switching Low Series Resistance D Low Junction Capacitance Low Thermal Resistance A RoHS* Compliant Applications B ISM Anode Description The MMP7060 - 69 Series of PIN diodes are fast Silicon switching, low series resistance, low capacitance C PIN diode chips. These diodes are also available packaged in several other package styles. The low Cathode junction capacitance, thin I-layer and low series resistances combine to produce outstanding insertion loss, isolation and switching time. The low thermal resistance enables these devices to safely handle moderately high power signals in high frequency switching applications. These rugged Dimensions (inches) devices are capable of reliable operation in all military, commercial and industrial applications. Dimension Min. Nom. Max. A 0.012 0.013 0.014 This series of PIN diodes are designed to be used in moderate peak and average power switch B 0.012 0.013 0.014 applications which operate at high frequencies and require low switching time. These diodes performs C 0.004 0.005 0.006 exceptionally well from UHF through microwave frequencies. D 0.003 0.004 0.005 Consult Factory for other package styles. * Restrictions on Hazardous Substances, compliant to current RoHS EU directive. 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: htt p s:// ww w.m a com . com / su p por t DC-0017765 High Power Switching and Attenuation Silicon PIN Diodes MMP706x Series Rev. V2 Electrical Specifications: T = +25C A Reverse Junction Minority Theta Series Se ries Se ries 2 4 Voltage Capacitance Carrier Resistance Resistance Resistance 1 3 Breakdown Lifetime 1 mA 10 mA 100 mA Model (V ) (C ) (T ) ( ) (R ) (R ) (R ) BR J L JC S S S V pF ns C/W Min. Max. Typ. Max. Max. Max. Max. MMP7060-11 0.05 1.0 20 25.0 10.0 2.0 MMP7061-11 0.08 1.0 20 20.0 8.0 1.5 MMP7062-11 250 0.10 1.0 20 15.0 6.0 1.2 MMP7063-11 0.20 1.0 15 8.0 3.5 1.0 MMP7064-11 0.30 1.5 15 6.0 2.0 0.8 MMP7065-11 0.08 1.5 15 40.0 8.0 1.5 MMP7067-11 0.20 1.5 12 10.0 4.0 1.0 500 MMP7068-11 0.30 2.0 10 8.0 3.5 0.8 MMP7069-11 0.50 2.0 10 6.0 2.0 0.7 Absolute Maximum Ratings Environmental Capabilities The MMP706x-11 Series of PIN diodes are capable of meeting the environmental requirements of MIL-STD-750 and MIL-STD-883. Operating Temperature -55C to +150C Static Sensitivity Storage Temperature -65C to +200C These electronic devices are sensitive to electrostatic discharge (ESD) and can be damaged Assembly Temperature <300C for 5 seconds by static electricity. Proper ESD control techniques should be used when handling these (HBM) Class 0 devices. Assembly Instructions Die attach of MMP706x silicon PIN diode chips may be accomplished with conductive epoxy or a eutectic solder such as Au(80%)/Sn(20%) or Au(88%)/ Ge(12%). Electrical connection to the cathode may be made with a Au wire or ribbon, utilizing thermo compression or thermosonic bonding. Care should be exercised to not employ excessive pressure or ultrasonic energy while wire/ribbon bonding to avoid physical damage to the die. 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: htt p s:// ww w.m a com . com / su p por t DC-0017765