X-On Electronics has gained recognition as a prominent supplier of MX25L6406EM2I-12G TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L6406EM2I-12G TR NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L6406EM2I-12G TR Macronix

MX25L6406EM2I-12G TR electronic component of Macronix
MX25L6406EM2I-12G TR Macronix
MX25L6406EM2I-12G TR NOR Flash
MX25L6406EM2I-12G TR  Semiconductors

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See Product Specifications
Part No. MX25L6406EM2I-12G TR
Manufacturer: Macronix
Category: NOR Flash
Description: FLASH SOP-8 RoHS
Datasheet: MX25L6406EM2I-12G TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2000: USD 1.375 ea
Line Total: USD 2750 
Availability - 1940
Ship by Thu. 03 Jul to Wed. 09 Jul
MOQ: 2000  Multiples: 2000
Pack Size: 2000
Availability Price Quantity
1940
Ship by Thu. 03 Jul to Wed. 09 Jul
MOQ : 2000
Multiples : 2000
2000 : USD 1.375

   
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We are delighted to provide the MX25L6406EM2I-12G TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L6406EM2I-12G TR and other electronic components in the NOR Flash category and beyond.

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MX25L6406E MX25L6406E DATASHEET P/N: PM1577 REV. 1.1, NOV. 17, 2010 1MX25L6406E Contents FEATURES ..................................................................................................................................................................5 GENERAL DESCRIPTION .........................................................................................................................................6 PIN CONFIGURATIONS .............................................................................................................................................7 PIN DESCRIPTION ......................................................................................................................................................7 BLOCK DIAGRAM .......................................................................................................................................................8 MEMORY ORGANIZATION .........................................................................................................................................9 Table 1. Memory Organization ............................................................................................................................ 9 DEVICE OPERATION ................................................................................................................................................10 Figure 1. Serial Modes Supported ....................................................................................................... 10 DATA PROTECTION .................................................................................................................................................. 11 Table 2. Protected Area Sizes ............................................................................................................................ 12 Table 3. 512 bit Secured OTP Definition ........................................................................................................... 12 HOLD FEATURES .....................................................................................................................................................13 Figure 2. Hold Condition Operation ........................................................................................................ 13 COMMAND DESCRIPTION .......................................................................................................................................14 Table 4. COMMAND DEFINITION ..................................................................................................................... 14 (1) Write Enable (WREN) ................................................................................................................................... 15 (2) Write Disable (WRDI) .................................................................................................................................... 15 (3) Read Status Register (RDSR) ...................................................................................................................... 15 (4) Write Status Register (WRSR) ...................................................................................................................... 16 Table 5. Protection Modes .................................................................................................................................. 17 (5) Read Data Bytes (READ) ............................................................................................................................. 18 (6) Read Data Bytes at Higher Speed (FAST READ) ....................................................................................... 18 (7) Dual Output Mode (DREAD) ......................................................................................................................... 18 (8) Sector Erase (SE) ......................................................................................................................................... 18 (9) Block Erase (BE) ........................................................................................................................................... 19 (10) Chip Erase (CE) .......................................................................................................................................... 19 (11) Page Program (PP) ..................................................................................................................................... 19 (12) Deep Power-down (DP) .............................................................................................................................. 20 (13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................. 20 (14) Read Identification (RDID) .......................................................................................................................... 21 (15) Read Electronic Manufacturer ID & Device ID (REMS) .............................................................................. 21 Table 6. ID DEFINITIONS ................................................................................................................................. 22 (16) Enter Secured OTP (ENSO) ....................................................................................................................... 22 (17) Exit Secured OTP (EXSO) .......................................................................................................................... 22 (18) Read Security Register (RDSCUR) ............................................................................................................ 23 Table 7. SECURITY REGISTER DEFINITION ................................................................................................... 23 (19) Write Security Register (WRSCUR) ............................................................................................................ 23 P/N: PM1577 REV. 1.1, NOV. 17, 2010 2

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Macronix International
MX7
MXA
MXIC(Macronix)
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