MLX75024RTF-GAA-000-SP

MLX75024 Time-of-Flight Sensor Array Preliminary datasheet All specifications subject to change without notice Features & Benefits Description 1/3 optical Time-of-Flight sensor MLX75024 is an optical time-of-flight (TOF) image 2 (optical area = 4.8 x 3.6 mm ) sensor. Potential use cases include gesture QVGA resolution, 320 x 240 pixels recognition, automotive in-cabin monitoring, 15 x 15 m DepthSense pixels surveillance, people counting and robot vision. The Demodulation frequency up to 40 MHz sensor features 320 x 240 (QVGA) time-of-flight Two dual channel analog outputs pixels based on DepthSense pixel technology. Pixel rate up to 80 MSPS MLX75024 is the successor of MLX75023, with 960 us minimum image readout time enhanced sensitivity and reduced power consumption. Gain modes for amplified signal In combination with MLX75123, Melexis dedicated 22% external quantum efficiency TOF companion chip provides a complete ToF sensor (850 nm wavelength) solution. 15% external quantum efficiency The sensor is available in automotive and industrial (940 nm wavelength) grades, both in a small glass BGA wafer level package Over 93% AC contrast form factor which offers many integration possibilities. (20 MHz modulation frequency) Over 85% AC contrast (40 MHz modulation frequency) Built-in temperature sensor Wafer level glass BGA package (Dimensions : 6.6 x 5.5 x 0.6 mm) AEC-Q100 qualified (grade 2) Ambient operating temperature ranges of -20 +85C and -40 to +105C Figure 1: MLX75024 top (left) and bottom (right) MLX75024 Time-of-Flight Sensor Array Preliminary datasheet Contents Features & Benefits ................................................................................................................................... 1 Description ................................................................................................................................................ 1 1. Datasheet Changelog ............................................................................................................................. 4 2. Glossary of terms ................................................................................................................................... 4 3. Ordering Information ............................................................................................................................ 5 4. Application System Architecture............................................................................................................ 6 5. Pinout Description ................................................................................................................................. 7 6. Typical Connection Diagram .................................................................................................................. 8 7. Block diagram ........................................................................................................................................ 9 8. Electrical Characteristics ...................................................................................................................... 10 8.1. Absolute Maximum Ratings ............................................................................................................. 10 8.2. Digital IO Characteristics .................................................................................................................. 10 8.3. Current consumption in operating conditions ................................................................................ 11 8.4. Dynamic Characteristics ................................................................................................................... 12 8.5. Temperature sensor characteristics ................................................................................................ 12 8.6. Sensor Optical and Physical Characteristics .................................................................................... 13 8.6.1. Demodulation contrast .................................................................. Error Bookmark not defined. 8.7. Signal Chain, Noise and Gain Modes Characteristics ...................................................................... 14 9. Device programming interface ............................................................................................................ 15 9.1. Configuration latches ........................................................................................................................ 15 9.2. Control of the CDS function ............................................................................................................. 16 10. Interface ............................................................................................................................................ 17 10.1. Timing Diagrams ............................................................................................................................. 17 10.2. Power Up ......................................................................................................................................... 18 10.3. LatchProg ........................................................................................................................................ 19 10.4. Reset ................................................................................................................................................ 19 10.5. Integration....................................................................................................................................... 19 10.6. Read-out .......................................................................................................................................... 20 10.7. Test Patterns Specification ............................................................................................................. 21 10.8. Test Columns Specification ............................................................................................................ 23 11. Recommendations for EMC ............................................................................................................... 25 12. Depth & Confidence Calculation ........................................................................................................ 27 12.1. Correlation Measurement .............................................................................................................. 27 Page 2 of 33 Version 0.10.5 All specifications subject to change without notice