MLX75026RTH-AAA-210-SP

MLX75026 QVGA Time-of-Flight Sensor PRELIMINARY DATASHEET v0.5 Features & Benefits Description 1/4 optical Time-of-Flight image sensor MLX75026 is a fully integrated optical Time-of- QVGA (320 x 240) pixel array Flight image sensor. Its perfectly suited for 10 x 10 m DepthSense pixels automotive and non-automotive applications, Integrated microlenses including, but not limited to, gesture Backside illumination (BSI technology) recognition, driver monitoring, skeleton External quantum efficiency 51% (850nm) tracking, people or obstacle detection and External quantum efficiency 28% (940nm) traffic monitoring. The sensor features a QVGA High distance accuracy due to programmable (320x240) pixel array based on the modulating frequencies up to 100MHz DepthSense pixel technology. Combined AC Demodulation contrast 85% (40 MHz) with a modulated light source this sensor is AC Demodulation contrast 78 % (100 MHz) capable of measuring object distance and Differential light source control with phase reflectivity under extreme background light delay feedback loop conditions, 120KLUX robust when using lens Full resolution distance framerate of with filter. This distance information can be max. 180 FPS (4 phases, Tint <250s, used to calculate a complete 3D point cloud 4lane 960mbps MIPI configuration) representation of a scene. Full resolution Up to 8 raw phases (or quads) per frame image acquisition up to 180 distance frames Per-phase statistics & diagnostics per second while supplied to a microcontroller Continuous or triggered operation mode(s) via a standardized MIPI CSI-2 serial camera 2 Configurable over I C (up to 400kHz) interface. The device is available in a cost CSI-2 serial data output, MIPI D-PHY, 1 clock optimized encapsulated package and offers a lane, 2 or 4 data lanes (<960 Mbps/lane) variety of integration possibilities. Build-in temperature sensor Region of interest (ROI) selection Integrated support for binning (2x2, 4x4, 8x8) Horizontal mirror & vertical flip image modes 9.2 x 7.8 x 1.0 mm encapsulated BGA package Number of pins = 80 Ambient operating temperature range of -40 +105C MSL level 3 rated AEC-Q100 qualified (grade 2) Preliminary Datasheet: Melexis reserves the right to change the product and specifications without prior notice. The information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the device. Melexis cannot assume responsibility for any problems arising out of the use of these circuits. MLX75026 QVGA Time-of-Flight Sensor PRELIMINARY DATASHEET Table of Contents Features & Benefits..................................................................................................................... 1 Description.................................................................................................................................. 1 Table of Contents ........................................................................................................................ 2 Document Revision History ......................................................................................................... 4 Ordering Information .................................................................................................................. 5 1. System Architecture ................................................................................................................ 6 2. Sensor Block Diagram .............................................................................................................. 7 3. Electrical Specifications ........................................................................................................... 8 3.1. Absolute Maximum Ratings ................................................................................................... 8 3.2. Typical Operating Conditions ................................................................................................. 8 3.3. Video Interface ...................................................................................................................... 9 3.4. Power Consumption ............................................................................................................ 10 3.5. Maximum Distance Frame Rate .......................................................................................... 12 3.6. Decoupling Recommendations ............................................................................................ 12 3.7. Power-up Sequence ............................................................................................................. 13 3.8. Input Clock Requirements ................................................................................................... 13 2 3.9. I C Specifications .................................................................................................................. 14 4. Optical Characteristics .......................................................................................................... 15 4.1. QVGA Pixel Array Configuration .......................................................................................... 15 4.2. Pixel & Image Array Characteristics ..................................................................................... 16 4.3. CRA (Chief Ray Angle) .......................................................................................................... 17 4.4. MTF (Modulation Transfer Function) .................................................................................. 18 4.5. Application Lens Design Recommendations ........................................................................ 18 5. Communication Interface(s) .................................................................................................. 19 2 5.1. I C (Inter-Integrated Circuit) ................................................................................................ 19 5.2. MIPI Alliance CSI-2 Description ............................................................................................ 23 6. Start-up Sequence ................................................................................................................. 25 6.1. Initialization Process ............................................................................................................ 26 6.2. Initialization Register Map ................................................................................................... 27 7. Register Settings ................................................................................................................... 29 7.1. Video Output Configuration ................................................................................................ 29 7.2. Modes of Operation ............................................................................................................ 30 7.3. Data Output Modes ............................................................................................................. 31 Preliminary Datasheet v0.5 Page 2 of 64