832TC Technical Data Sheet Thermally Conductive Epoxy, Encapsulating & Potting Compound Description 832TC potting and encapsulating compound is a thermally conductive, black, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where thermal management is a concern. Due to its high thermal conductivity, it protects circuits, by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 1:1 volume mix ratio, making it compatible with most dispensing equipment. 832TC can be cured at room temperature or higher. Features and Benefits Thermal conductivity of 0.68 W/(mK) Low exotherm Convenient 1A:1B volume mix ratio High compressive and tensile strength Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics Excellent electrical insulating characteristics Extreme resistance to water and humidity (allows for submersion where needed) Solvent-free ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 D a t e : 10 J u l y 2 0 19 / V e r. 3 . 0 2 Page 1832TC Usage Parameters Properties Value Working life 22 C 72 F 2 h Shelf life 5 y Full cure 22 C 72 F 96 h Full cure 65 C 149 F 2 h Full cure 80 C 176 F 1 h Full cure 100 C 212 F 45 min Temperature Ranges Properties Value Constant service temperature -30 to 175 C -22 to 347 F a) Maximum intermittent temperature 200 C 392 F Storage temperature of unmixed parts 16 to 27 C 61 to 81 F a) Temperature that can be withstood for short periods without sustaining damage. ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 Date: 10 July 2019 / Ver. 3.02 Page 2