X-On Electronics has gained recognition as a prominent supplier of 23LC512-IP SRAM across the USA, India, Europe, Australia, and various other global locations. 23LC512-IP SRAM are a product manufactured by Microchip. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

23LC512-IP Microchip

23LC512-IP electronic component of Microchip
23LC512-IP Microchip
23LC512-IP SRAM
23LC512-IP  Semiconductors

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See Product Specifications
Part No. 23LC512-IP
Manufacturer: Microchip
Category: SRAM
Description: Microchip Technology SRAM 512K 2.5V SPI SERIAL SRAM SQI
Datasheet: 23LC512-IP Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.2 ea
Line Total: USD 2.2 
Availability - 1683
Ship by Tue. 06 May to Thu. 08 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1683
Ship by Tue. 06 May to Thu. 08 May
MOQ : 1
Multiples : 1
1 : USD 2.2
25 : USD 1.881
120 : USD 1.87

   
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We are delighted to provide the 23LC512-IP from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 23LC512-IP and other electronic components in the SRAM category and beyond.

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23A512/23LC512 512Kbit SPI Serial SRAM with SDI and SQI Interface Device Selection Table Part Temp. Dual I/O Quad I/O Max. Clock VCC Range Packages Number Ranges (SDI) (SQI) Frequency (1) 23A512 1.7-2.2V I, E Yes Yes 20 MHz SN, ST, P (1) 23LC512 2.5-5.5V I, E Yes Yes 20 MHz SN, ST, P Note 1: 16 MHz for E-temp. Features: Description: SPI-Compatible Bus Interface: The Microchip Technology Inc. 23A512/23LC512 are 512Kbit Serial SRAM devices. The memory is - 20 MHz Clock rate accessed via a simple Serial Peripheral Interface (SPI) - SPI/SDI/SQI mode compatible serial bus. The bus signals required are a Low-Power CMOS Technology: clock input (SCK) plus separate data in (SI) and data - Read Current: 3 mA at 5.5V, 20 MHz out (SO) lines. Access to the device is controlled - Standby Current: 4 A at +85C through a Chip Select (CS) input. Additionally, SDI (Serial Dual Interface) and SQI (Serial Quad Interface) Unlimited Read and Write Cycles is supported if your application needs faster data rates. Zero Write Time This device also supports unlimited reads and writes to 64K x 8-bit Organization: the memory array. - 32-byte page The 23A512/23LC512 is available in standard Byte, Page and Sequential mode for Reads and packages including 8-lead SOIC, PDIP and advanced Writes 8-lead TSSOP. High Reliability Temperature Ranges Supported: Package Types (not to scale) - Industrial (I): -40Cto +85C - Automotive (E): -40C to +125C RoHS Compliant 8-Lead SOIC, TSSOP and PDIP Packages SOIC/TSSOP/PDIP CS 1 8 VCC Pin Function Table SO/SIO1 2 7 HOLD/SIO3 Name Function SIO2 3 6 SCK CS Chip Select Input VSS 4 5 SI/SIO0 SO/SIO1 Serial Output/SDI/SQI Pin SIO2 SQI Pin VSS Ground SI/SIO0 Serial Input/SDI/SQI Pin SCK Serial Clock HOLD/SIO3 Hold/SQI Pin VCC Power Supply 2012-2013 Microchip Technology Inc. DS20005155B-page 123A512/23LC512 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +0.3V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature under bias.............................................................................................................-40C to +125C NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40C to +85C DC CHARACTERISTICS Automotive (E): TA = -40C to +125C Param. Sym. Characteristic Min. Typ. Max. Units Test Conditions No. D001 VCC Supply voltage 1.7 2.2 V 23A512 2.5 5.5 23LC512 D002 VIH High-level input 0.7 VCC VCC + 0.3 V voltage D003 VIL Low-level input -0.3 0.2 VCC V 23A512 voltage 0.1 VCC 23LC512 D004 VOL Low-level output 0.2 VIOL = 1 mA voltage D005 VOH High-level output VCC - 0.5 V IOH = -400 A voltage D006 ILI Input leakage 1 ACS = VCC, VIN = VSS OR VCC current D007 ILO Output leakage 1 ACS = VCC, VOUT = VSS OR VCC current D008 ICC Read Operating current 1 10 mA FCLK = 20 MHz SO = O, 2.2V 3 10 mA FCLK = 20 MHz SO = O, 5.5V D009 ICCS Standby current 1 4 A CS = VCC = 2.2V, Inputs tied to VCC or VSS, I-Temp 12 A CS = VCC = 2.2V, Inputs tied to VCC or VSS, E-Temp 4 10 A CS = VCC = 5.5V, Inputs tied to VCC or VSS, I-Temp 20 A CS = VCC = 5.5V, Inputs tied to VCC or VSS, E-Temp D010 CINT Input capacitance 7 pF VCC = 5.0V, f = 1 MHz, TA = 25C (Note 1) D011 VDR RAM data retention 1.0 V (Note 2) voltage Note 1: This parameter is periodically sampled and not 100% tested. 2: This is the limit to which VCC can be lowered without losing RAM data. This parameter is periodically sampled and not 100% tested. 3: Typical measurements taken at room temperature. DS20005155B-page 2 2012-2013 Microchip Technology Inc.

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8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
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