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24LC128T-EMS

24LC128T-EMS electronic component of Microchip

Datasheet
Microchip Technology EEPROM 128K 16K X 8 2.5V SER EE EXT TEMP MSOP

Manufacturer: Microchip
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Price (USD)

1: USD 1.1475 ea
Line Total: USD 1.15

4438 - Global Stock
Ships to you between
Wed. 15 May to Fri. 17 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3778 - WHS 1


Ships to you between Wed. 15 May to Fri. 17 May

MOQ : 1
Multiples : 1

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24LC128T-EMS
Microchip

1 : USD 0.9119
25 : USD 0.9119
100 : USD 0.9085

     
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24AA128/24LC128/24FC128 2 128K I C CMOS Serial EEPROM Temperature Ranges: Device Selection Table - Industrial (I): -40 C to +85 C Part VCC Max. Clock Temp. - Automotive (E): -40 C to +125 C Number Range Frequency Ranges (1) 24AA128 1.7-5.5V 400 kHz I Description: 24LC128 2.5-5.5V 400 kHz I, E The Microchip Technology Inc. 24AA128/24LC128/ (2) 24FC128 1.7-5.5V 1 MHz I 24FC128 (24XX128*) is a 16K x 8 (128 Kbit) Serial Electrically Erasable PROM (EEPROM), capable of Note 1: 100 kHz for VCC < 2.5V. operation across a broad voltage range (1.7V to 5.5V). 2: 400 kHz for VCC < 2.5V. It has been developed for advanced, low-power Features: applications such as personal communications or data acquisition. This device also has a page write capabil- Single Supply with Operation down to 1.7V for ity of up to 64 bytes of data. This device is capable of 24AA128/24FC128 devices, 2.5V for 24LC128 both random and sequential reads up to the 128K Devices boundary. Functional address lines allow up to eight Low-Power CMOS Technology: devices on the same bus, for up to 1 Mbit address - Write current 3 mA, typical space. This device is available in the standard 8-pin plastic DIP, SOIC (3.90 mm and 5.28 mm), TSSOP, - Standby current 100 nA, typical 2 MSOP, DFN, TDFN and Chip Scale packages. 2-Wire Serial Interface, I C Compatible Cascadable up to Eight Devices Block Diagram Schmitt Trigger Inputs for Noise Suppression A0 A1 A2WP HV Generator Output Slope Control to Eliminate Ground Bounce 100 kHz and 400 kHz Clock Compatibility 1 MHz Clock for FC Versions I/O Memory EEPROM Control Control XDEC Page Write Time 5 ms, typical Array Logic Logic Self-Timed Erase/Write Cycle Page Latches 64-Byte Page Write Buffer I/O Hardware Write-Protect SCL YDEC ESD Protection >4000V SDA More than 1 Million Erase/Write Cycles Data Retention > 200 years VCC Factory Programming Available Sense Amp. VSS Packages include 8-lead PDIP, SOIC, TSSOP, R/W Control DFN, TDFN, MSOP, and Chip Scale Packages Pb-Free and RoHS Compliant *24XX128 is used in this document as a generic part number for the 24AA128/24LC128/24FC128 devices. Package Types 1 PDIP/SOIC TSSOP/MSOP 2 DFN/TDFN CS (Chip Scale) VCC A1 A0 A0 1 8 VCC 1 8 A0 1 A0 VCC 8 VCC 12 3 2 A1 2 7 WP 2 7 A1 7 WP A1 WP 45 WP A2 3 A2 6 SCL 8 A2 3 6 SCL 6 7 3 6 A2 SCL 4 VSS 5 SDA SDA SCL VSS VSS 4 5 SDA 4 5 VSS SDA (TOP DOWN VIEW, BALLS NOT VISIBLE) Note 1: Pins A0 and A1 are no-connects for the MSOP package only. 2: Available in I-temp, AA only. 2010 Microchip Technology Inc. DS21191S-page 1 24XX128 24XX128 24XX12824AA128/24LC128/24FC128 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C ESD protection on all pins 4kV NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Electrical Characteristics: DC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40C to +85C Automotive (E): VCC = +2.5V to 5.5V TA = -40C to 125C Param. Sym. Characteristic Min. Max. Units Conditions No. A0, A1, A2, SCL, SDA and WP pins: D1 VIH High-level input voltage 0.7 VCC V D2 VIL Low-level input voltage 0.3 VCC V VCC 2.5V 0.2 VCC V VCC < 2.5V D3 VHYS Hysteresis of Schmitt Trigger 0.05 VCC VVCC 2.5V (Note 1) inputs (SDA, SCL pins) D4 VOL Low-level output voltage 0.40 V IOL = 3.0 mA VCC = 4.5V IOL = 2.1 mA VCC = 2.5V D5 ILI Input leakage current 1 AVIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC D6 ILO Output leakage current 1 AVOUT = VSS or VCC D7 CIN, Pin capacitance 10 pFVCC = 5.0V (Note 1) COUT (all inputs/outputs) TA = 25C, FCLK = 1 MHz D8 ICC Read Operating current 400 AVCC = 5.5V, SCL = 400 kHz ICC Write 3 mA VCC = 5.5V D9 ICCS Standby current 1 ATA = -40C to +85C SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS 5 ATA = -40C to 125C SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS Note 1: This parameter is periodically sampled and not 100% tested. DS21191S-page 2 2010 Microchip Technology Inc.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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