Product Information

24LC32AF-I/ST

24LC32AF-I/ST electronic component of Microchip

Datasheet
Memory; EEPROM; I2C; 4kx8bit; 2.5÷5.5V; 400kHz; TSSOP8

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.5382 ea
Line Total: USD 0.54

3677 - Global Stock
Ships to you between
Fri. 17 May to Tue. 21 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2134 - WHS 1


Ships to you between Mon. 13 May to Fri. 17 May

MOQ : 100
Multiples : 100

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24LC32AF-I/ST
Microchip

100 : USD 0.6056
300 : USD 0.5846
1000 : USD 0.5788
2500 : USD 0.5731
5000 : USD 0.5689
7500 : USD 0.5646
10000 : USD 0.5604
15000 : USD 0.5561

3677 - WHS 2


Ships to you between Fri. 17 May to Tue. 21 May

MOQ : 1
Multiples : 1

Stock Image

24LC32AF-I/ST
Microchip

1 : USD 0.5382
25 : USD 0.5382
100 : USD 0.5382

2134 - WHS 3


Ships to you between Mon. 13 May to Fri. 17 May

MOQ : 200
Multiples : 100

Stock Image

24LC32AF-I/ST
Microchip

200 : USD 0.7584

     
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24AA32AF/24LC32AF 2 32K I C Serial EEPROM with Quarter-Array Write-Protect Device Selection Table Description: Part VCC Max. Clock Temp. The Microchip Technology Inc. 24AA32AF/24LC32AF Number Range Frequency Ranges (24XX32AF*) is a 32 Kbit Electrically Erasable PROM. The device is organized as a single block of 4K x 8-bit (1) 24AA32AF 1.7-5.5 400 kHz I memory with a 2-wire serial interface. Low-voltage 24LC32AF 2.5-5.5 400 kHz I, E design permits operation down to 1.7V, with standby Note 1: 100 kHz for VCC <2.5V. and read currents of only 1 A and 400 A, respectively. It has been developed for advanced, low- power applications such as personal communications Features: or data acquisition. The 24XX32AF also has a page Single Supply with Operation down to 1.7V for write capability for up to 32 bytes of data. Functional 24AA32AF devices, 2.5V for 24LC32AF devices address lines allow up to eight devices on the same bus, for up to 256 Kbits address space. The 24XX32AF Low-Power CMOS Technology: is available in the standard 8-pin PDIP, surface mount - Read current 400 A, max. SOIC, TSSOP, TDFN and MSOP packages. The - Standby current 1 A, max. (I-temp) 24XX32AF is also available in the 5-lead SOT-23 2 2-Wire Serial Interface, I C Compatible package. Packages with 3 Address Pins are Cascadable up Block Diagram to Eight Devices Schmitt Trigger Inputs for Noise Suppression A0 A1 A2 WP HV Generator Output Slope Control to Eliminate Ground Bounce 100 kHz and 400 kHz Clock Compatibility Page Write Time 5 ms max. I/O Memory EEPROM Control XDEC Control Self-Timed Erase/Write Cycle Array Logic Logic 32-Byte Page Write Buffer Page Latches Hardware Write-Protect for 1/4 Array (C00h-FFFh) I/O SCL ESD Protection > 4,000V YDEC More than 1 Million Erase/Write Cycles SDA Data Retention > 200 Years Vcc Factory Programming Available Sense Amp. VSS Packages Include 8-lead PDIP, SOIC, TSSOP, R/W Control MSOP, TDFN and 5-lead SOT-23 Pb-Free and RoHS Compliant Temperature Ranges: - Industrial (I): -40C to +85C - Automotive (E): -40C to +125C Package Types PDIP, MSOP, SOIC, TSSOP SOT-23 TDFN A0 1 8 VCC SCL WP 1 5 A0 1 8 VCC 2 7 WP A1 2 7 WP A1 VSS 2 SCL 3 6 A2 A2 3 6 SCL VSS 4 5 34 VCC SDA SDA VSS 4 5 SDA *24XX32AF is used in this document as a generic part number for the 24AA32AF/24LC32AF devices. 2009 Microchip Technology Inc. DS22184A-page 124AA32AF/24LC32AF 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C ESD protection on all pins ...................................................................................................................................................... 4 kV NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40C to +85C, VCC = +1.7V to +5.5V DC CHARACTERISTICS Automotive (E): TA = -40C to +125C, VCC = +2.5V to +5.5V Param. Symbol Characteristic Min. Typ. Max. Units Conditions No. D1 A0, A1, A2, WP, SCL and SDA pins D2 VIH High-level input voltage 0.7 VCC V D3 VIL Low-level input voltage 0.3 VCC V VCC 2.5V 0.2 VCC V VCC < 2.5V D4 VHYS Hysteresis of Schmitt 0.05 VCC V VCC 2.5V (Note 1) Trigger inputs (SDA, SCL pins) D5 VOL Low-level output voltage 0.40 V IOL = 3.0 mA, VCC = 4.5V IOL = 2.1 mA, Vcc = 2.5V D6 ILI Input leakage current 1 AVIN = VSS or VCC D7 ILO Output leakage current 1 AVOUT = VSS or VCC D8 CIN, Pin capacitance 10 pFVCC = 5.0V (Note 1) COUT (all inputs/outputs) TA = 25C, FCLK = 1 MHz D9 ICC write Operating current 0.1 3 mAVCC = 5.5V, SCL = 400 kHz D10 ICC read 0.05 400 A CCS Standby current 0.01 1 A Industrial D11 I 5 A Automotive SDA = SCL = VCC = 5.5V A0, A1, A2, WP = VSS Note 1: This parameter is periodically sampled and not 100% tested. 2: Typical measurements taken at room temperature. DS22184A-page 2 2009 Microchip Technology Inc.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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