MCP631/2/3/4/5/9 24 MHz, 2.5 mA Rail-to-Rail Output (RRO) Op Amps Features: Description: Gain-Bandwidth Product: 24 MHz The Microchip Technology Inc. MCP631/2/3/4/5/9 family of operational amplifiers features high gain Slew Rate: 10 V/s bandwidth product (24 MHz, typical) and high output Noise: 10 nV/ Hz at 1 MHz) short-circuit current (70mA, typical). Some also Low Input Bias Current: 4 pA (typical) provide a Chip Select (CS) pin that supports a Ease of Use: low-power mode of operation. These amplifiers are - Unity-Gain Stable optimized for high speed, low noise and distortion, - Rail-to-Rail Output single-supply operation with rail-to-rail output and an input that includes the negative rail. - Input Range including Negative Rail This family is offered in single (MCP631), single with - No Phase Reversal pin (MCP633), dual (MCP632), dual with two CS CS Supply Voltage Range: +2.5V to +5.5V pins (MCP635), quad (MCP634) and quad with two High Output Current: 70 mA Chip Select pins (MCP639). All devices are fully Supply Current: 2.5 mA/ch (typical) specified from -40C to +125C. Low-Power Mode: 1 A/ch Small Packages: SOT23-5, DFN Typical Application Circuit Extended Temperature Range: -40C to +125C MCP63X 0A 20 A Typical Applications: +5V Fast Low-Side Current Sensing 51.1 Point-of-Load Control Loops + V OUT Power Amplifier Control Loops - 0.005 0V 4V Barcode Scanners Optical Detector Amplifier Multi-Pole Active Filter 51.1 2.0 k Design Aids: SPICE Macro Models FilterLab Software Microchip Advanced Part Selector (MAPS) Analog Demonstration and Evaluation Boards Application Notes High Gain-Bandwidth Op Amp Portfolio Model Family Channels/Package Gain-Bandwidth V (max.) I /Ch (typ.) OS Q MCP621/1S/2/3/4/5/9 1, 2, 4 20 MHz 0.2 mV 2.5 mA MCP631/2/3/4/5/9 1, 2, 4 24 MHz 8.0 mV 2.5 mA MCP651/1S/2/3/4/5/9 1, 2, 4 50 MHz 0.2 mV 6.0 mA MCP660/1/2/3/4/5/9 1, 2, 3, 4 60 MHz 8.0 mV 6.0 mA 2009-2014 Microchip Technology Inc. DS20002197C-page 1MCP631/2/3/4/5/9 Package Types MCP631 MCP631 MCP631 MCP634 SOIC 2x3 TDFN* SOT-23-5 SOIC, TSSOP NC 1 8 NC V NC 1 8 NC V 1 14 OUTD OUTA V 1 5 V OUT DD 2 7 V V V - V - 2 13 IN DD V 2 7 V INA IND IN EP DD V 2 3 6 9 V + V + V SS V + INA 3 12 IN OUT V + V IND 3 6 IN OUT V 4 5 V V NC DD 4 11 V 4 5 NC SS SS SS V - V + 3 4 IN IN V + 5 10 V + INB INC V - V - INB 6 9 INC V 7 8 V OUTB OUTC MCP632 MCP632 MCP633 MCP633 SOIC 3x3 DFN* SOT-23-6 SOIC V V 1 8 V NC 1 8 CS V 1 8 DD OUTA DD V OUTA V 6 1 DD OUT V V 2 7 2 7 V 2 7 V V V INA OUTB OUTB IN DD INA EP CS 5 V 2 3 6 V - V + 9 V SS V + V V + 3 6 3 6 INB INA INB IN OUT INA V + V 4 5 NC V 4 5 V 4 5 V + INB SS SS SS INB V - 3 4 V + IN IN MCP639 4x4 QFN* MCP635 MCP635 MSOP 3x3 DFN* 16 15 14 13 V V 1 10 OUTA DD V - V + V 1 10 V 1 12 INA IND OUTA DD V 2 9 V INA OUTB V 2 V 9 INA OUTB V + V 2 11 INA EP SS V + EP 3 8 V - V + 3 V - INA 8 INB INA INB 17 V V + 3 10 DD INC 11 4 V V 7 V + V + SS INB SS 4 7 INB V + V - 5 4 9 6 INB INC CSA CSB CSA 5 6 CSB 567 8 * Includes Exposed Thermal Pad (EP) see Table 3-1. DS20002197C-page 2 2009-2014 Microchip Technology Inc. V - V INB OUTA V CSAD OUTB CSBC V OUTD V - V IND OUTC