Product Information

MSMBJSAC7.0e3

MSMBJSAC7.0e3 electronic component of Microchip

Datasheet
ESD Suppressors / TVS Diodes Uni-Directional TVS
Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

400: USD 2.4579 ea
Line Total: USD 983.16

0 - Global Stock
MOQ: 400  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 400
Multiples : 1

Stock Image

MSMBJSAC7.0e3
Microchip

400 : USD 2.4579
4000 : USD 2.3575
40000 : USD 2.3103

0 - WHS 2


Ships to you between Mon. 27 May to Wed. 29 May

MOQ : 400
Multiples : 400

Stock Image

MSMBJSAC7.0e3
Microchip

400 : USD 3.224

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Package / Case
Packaging
Brand
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
Taric
LoadingGif

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Additional Infomation About Product

MSMBG5.0A MXLSMBG170CAe3, MSMBJ5.0A MXLSMBJ170CAe3 Screening in 600 Watt Surface Mount reference to Available MIL-PRF-19500 Transient Voltage Suppressor available DESCRIPTION The MSMB 5.0A MSMB 170CA series of surface mount 600 watt transient voltage suppressors provide a selection of standoff voltages (Vwm) from 5.0 to 170 V. These high-reliability devices are available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO- 215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO- 214AA package allows for greater PC board mounting density. It is available with SnPb or RoHS compliant matte-tin plating. DO-215AA Important: For the latest information, visit our website MSMBG5.0A MXLSMBG170CAe3, MSMBJ5.0A MXLSMBJ170CAe3 MECHANICAL and PACKAGING CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements. TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026. MARKING: Part number. POLARITY: Cathode end banded. TAPE & REEL option: Standard per EIA-481-1-A (add TR suffix to part number). Consult factory for quantities. WEIGHT: Approximately 0.1 grams. See Package Dimensions on last page. PART NOMENCLATURE M SM B G 5.0 C A e3 Reliability Level* RoHS Compliance M e3 = RoHS Compliant MA Blank = non-RoHS Compliant MX MXL +/- 5% Tolerance Level *(see High Reliability Up- Screened Plastic Products Polarity Portfolio) C = bidirectional Blank = unidirectional Surface Mount Package Stand-Off Voltage (V ) WM 600 W Power Level (see Electrical Characteristics table) Lead Form G = Gull-Wing J = J-Bend SYMBOLS & DEFINITIONS Symbol Definition Working Peak (Standoff) Voltage - The maximum peak voltage that can be applied over the operating temperature V WM range. This is also referred to as standoff voltage. P Peak Pulse Power - Rated random recurring peak impulse power dissipation. PP V Breakdown Voltage - The minimum voltage the device will exhibit at a specified current. ( BR) I Standby Current - The current at the rated standoff voltage (V ). D WM I PP Peak Pulse Current - The peak current during the impulse. Clamping Voltage - Clamping voltage at I (peak pulse current) at the specified pulse conditions (typically shown as PP V C maximum value). I Breakdown Current The current used for measuring breakdown voltage V . BR ( BR) RF01000, Rev. C (1/4/13) 2013 Microsemi Corporation Page 2 of 7

HS Compliance

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS

Microchip may also be referenced as

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Atmel
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M4S
M6S
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M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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